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Philosophical Magazine Volume 99, 2019 - Issue 15
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Part A: Materials Science

An investigation of influencing of Sb and Bi contents on surface tensions associated with Pb-free Sn-Zn-Sb-Bi quaternary and sub-quaternary solder alloys

Ali DoganScience and Art Faculty, Department of Physics, Kahramanmaras Sutcuimam UniversityOnikisubat/Kahramanmaras, TurkeyORCID Iconhttp://orcid.org/0000-0003-1348-5310
ORCID Icon &
Hüseyin ArslanScience and Art Faculty, Department of Physics, Kahramanmaras Sutcuimam UniversityOnikisubat/Kahramanmaras, Turkey;Department of Material Science and Engineering, Kahramanmaras Sutcuimam University, Istitute for Graduate Studies in Science and Technology, Onikisubat/Kahramanmaras, TurkeyCorrespondence[email protected]
ORCID Iconhttp://orcid.org/0000-0003-1509-7725
ORCID Icon
Pages 1825-1848 | Received 08 May 2018, Accepted 15 Mar 2019, Published online: 24 Apr 2019

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Yizhou Tang, Can Huang, Zhuangzhi Yang, Yuangang Wang, Man Huang, Fuxiang Huang, Jian Tu & Zhiming Zhou. (2020) Estimation of surface tension for high temperature melts of the binary Ag-X alloys. Philosophical Magazine 100:16, pages 2128-2142.
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Rachida M’chaar, Abdelaziz Sabbar, Mouloud El Moudane & Noureddine Ouerfelli. (2020) A survey of surface tension, molar volume and density for Sn–Ag–Cu–Bi–Sb quinary alloys as lead-free solders. Philosophical Magazine 100:11, pages 1415-1438.
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Articles from other publishers (8)

Clarissa Cruz, Thiago Soares, André Barros, Amauri Garcia & Noé Cheung. (2023) The Influence of Interfacial Thermal Conductance on the Tensile Strength of a Sn-Mg Solder Alloy. Metals 13:11, pages 1813.
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Ab Aziz bin Mohd Yusof, Mohd Al Fatihhi Mohd Szali Januddi & Muhamad Noor Harun. (2022) A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials. Ain Shams Engineering Journal 13:6, pages 101769.
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Esra ÖZTÜRK. (2022) In, Ag, Al Katkılı Kurşunsuz Sn-Zn Lehim Alaşım Sistemlerinin Mekanik ve Mikroyapısal Özellikleri. Afyon Kocatepe University Journal of Sciences and Engineering 22:3, pages 477-485.
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Dexiang Hou, Pengcheng Cai, Jun Luan, Zhigang Yu, Jieyu Zhang & Kuo-Chih Chou. (2022) Application of surface tension in the design of novel Sn-Ag-Cu-based solders. Journal of Non-Crystalline Solids 582, pages 121444.
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Lei Shi, Wenxin Hu, Chao Li, Zhigang Yu, Jieyu Zhang & Guangxin Wu. (2022) Application of an optimized geometrical model in predicting the physicochemical properties of Sn-based alloys. Calphad 76, pages 102385.
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Dheeraj Varanasi & Manoj Kumar Pal. (2022) Density and Dynamic Viscosity of Sn, Sn–Ag, and Sn–Ag–Cu Liquid Lead-Free Solder Alloys. Powder Metallurgy and Metal Ceramics 60:7-8, pages 504-512.
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George Kaptay. (2020) A coherent set of model equations for various surface and interface energies in systems with liquid and solid metals and alloys. Advances in Colloid and Interface Science 283, pages 102212.
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Zhigang Yu, Haiyan Leng, Qun Luo, Jieyu Zhang, Xiaochun Wu & Kuo-Chih Chou. (2020) New insights into ternary geometrical models for material design. Materials & Design 192, pages 108778.
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