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International Journal for Computational Methods in Engineering Science and Mechanics Volume 9, 2008 - Issue 2
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Original Articles

Modeling and Simulation of Electronic Packages Subjected to Drop Impact

M. I. Sakri PSG College of Technology, Coimbatore, Tamilnadu, India
,
S. Saravanan PSG College of Technology, Coimbatore, Tamilnadu, India
&
P. V. Mohanram PSG College of Technology, Coimbatore, Tamilnadu, India
Pages 138-148 | Received 20 Oct 2007, Accepted 01 Nov 2007, Published online: 22 Jan 2008

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Read on this site (1)

Thaiping Chen & Ting‐Xuan Su. (2010) Adhesive features of bonded interfaces subjected to temperature shock. Journal of the Chinese Institute of Engineers 33:6, pages 935-943.
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Articles from other publishers (1)

Hailong Huang, Yi Wan & Kai Zhou. (2020) PCB thermal reliability characteristics analysis under ambient temperature. Journal of Computational Methods in Sciences and Engineering 20:3, pages 853-858.
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