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Virtual and Physical Prototyping Volume 19, 2024 - Issue 1
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Research Article

Development of strong, stiff and lightweight compression-resistant mechanical metamaterials by refilling tetrahedral wireframes

Pengkun Guoa School of Mechanical Engineering and Automation, Harbin Institute of Technology, Shenzhen, People’s Republic of ChinaView further author information
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Yang Wua School of Mechanical Engineering and Automation, Harbin Institute of Technology, Shenzhen, People’s Republic of China;b Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics, Harbin Institute of Technology, Shenzhen, People’s Republic of ChinaCorrespondence[email protected]
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Ruiguang Chena School of Mechanical Engineering and Automation, Harbin Institute of Technology, Shenzhen, People’s Republic of China;d Shenzhen Key Laboratory of Flexible Printed Electronics Technology, Harbin Institute of Technology, Shenzhen, People’s Republic of ChinaView further author information
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Bingxian Lua School of Mechanical Engineering and Automation, Harbin Institute of Technology, Shenzhen, People’s Republic of ChinaView further author information
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Yunfeng Jiab Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics, Harbin Institute of Technology, Shenzhen, People’s Republic of China;c School of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen, People’s Republic of ChinaView further author information
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Weijian Zhangc School of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen, People’s Republic of China;d Shenzhen Key Laboratory of Flexible Printed Electronics Technology, Harbin Institute of Technology, Shenzhen, People’s Republic of ChinaView further author information
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Boxuan Caoc School of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen, People’s Republic of China;d Shenzhen Key Laboratory of Flexible Printed Electronics Technology, Harbin Institute of Technology, Shenzhen, People’s Republic of ChinaView further author information
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Suzhu Yuc School of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen, People’s Republic of China;d Shenzhen Key Laboratory of Flexible Printed Electronics Technology, Harbin Institute of Technology, Shenzhen, People’s Republic of ChinaCorrespondence[email protected]
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&
Jun Weic School of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen, People’s Republic of China;d Shenzhen Key Laboratory of Flexible Printed Electronics Technology, Harbin Institute of Technology, Shenzhen, People’s Republic of China;e State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, People’s Republic of ChinaCorrespondence[email protected]
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Article: e2365852 | Received 31 Mar 2024, Accepted 04 Jun 2024, Published online: 08 Jul 2024

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