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Original Articles

Development of a Vibration Device for Grinding with Microvibration

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Pages 1121-1132 | Received 19 Sep 2003, Accepted 04 Dec 2003, Published online: 07 Feb 2007

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Read on this site (5)

Xue-Hui Shen & Guo-Feng Xu. (2018) Study of milling force variation in ultrasonic vibration-assisted end milling. Materials and Manufacturing Processes 33:6, pages 644-650.
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J. Primo Benitez-Rangel, Miguel Trejo-Hernández, L. Alberto Morales-Hernández & Aurelio Domínguez-González. (2010) Improvement of the Injection Mold Process by Using Vibration Through a Mold Accessory. Materials and Manufacturing Processes 25:7, pages 577-580.
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Z.W. Zhong & Z.Y. Rui. (2005) Grinding of Single-Crystal Silicon Using a Microvibration Device. Materials and Manufacturing Processes 20:4, pages 687-696.
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Vaios Tsiakoumis. 2022. Advances in Manufacturing Processes, Intelligent Methods and Systems in Production Engineering. Advances in Manufacturing Processes, Intelligent Methods and Systems in Production Engineering 215 226 .
Mohamed Yassin, Mohab Hossam & Hassan El-Hofy. (2018) Applications and Designs of Vibration-Assisted Machining Devices. Key Engineering Materials 775, pages 480-486.
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Yusuf S. Dambatta, Ahmed A. D. Sarhan, M. Sayuti & M. Hamdi. (2017) Ultrasonic assisted grinding of advanced materials for biomedical and aerospace applications—a review. The International Journal of Advanced Manufacturing Technology 92:9-12, pages 3825-3858.
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Andre D. L. Batako & Vaios Tsiakoumis. (2014) An experimental investigation into resonance dry grinding of hardened steel and nickel alloys with element of MQL. The International Journal of Advanced Manufacturing Technology 77:1-4, pages 27-41.
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Li Ma, Ci Xiong Xu, Sha Sha Zhou, Wei Bin Rong & Li Ning Sun. (2011) Flexure Hinge Guided Motion Gripper with Force Sensor. Applied Mechanics and Materials 121-126, pages 3299-3303.
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Suresh Kumar, Sivarao, MT Cheong, Mohd Azmeer & Harun Fuaida. (2010) Solving eventual bonding quality to enhance adhesion for QFN packages. Solving eventual bonding quality to enhance adhesion for QFN packages.
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Z. W. Zhong & Z. F. Peng. (2006) Fractal roughness structures of precision-machined WC-Co- and Inconel 625-coated steel rods. The International Journal of Advanced Manufacturing Technology 33:9-10, pages 885-890.
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Z.W. Zhong & S.Y. Chan. (2007) Investigation of a gripping device actuated by SMA wire. Sensors and Actuators A: Physical 136:1, pages 335-340.
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S.K. Nah & Z.W. Zhong. (2007) A microgripper using piezoelectric actuation for micro-object manipulation. Sensors and Actuators A: Physical 133:1, pages 218-224.
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K.S. Goh & Z.W. Zhong. (2007) A new bonding-tool solution to improve stitch bondability. Microelectronic Engineering 84:1, pages 173-179.
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K.S. Goh & Z.W. Zhong. (2006) Development of capillaries for wire bonding of low-k ultra-fine-pitch devices. Microelectronic Engineering 83:10, pages 2009-2014.
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Z.W. Zhong, Z.F. Wang & Y.H. Tan. (2006) Chemical mechanical polishing of polymeric materials for MEMS applications. Microelectronics Journal 37:4, pages 295-301.
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Z.W. Zhong & C.K. Yeong. (2006) Development of a gripper using SMA wire. Sensors and Actuators A: Physical 126:2, pages 375-381.
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Z.W. Zhong & K.S. Goh. (2006) Investigation of ultrasonic vibrations of wire-bonding capillaries. Microelectronics Journal 37:2, pages 107-113.
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Z.W. Zhong, Z.F. Wang & B.M.P. Zirajutheen. (2005) Chemical mechanical polishing of polycarbonate and poly methyl methacrylate substrates. Microelectronic Engineering 81:1, pages 117-124.
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Jonathan Tan, Zhao Wei Zhong & Hong Meng Ho. (2005) Wire-bonding process development for low-k materials. Microelectronic Engineering 81:1, pages 75-82.
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