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Miscellany

Strategies for Optimal Chemical Mechanical Polishing (CMP) Slurry Design

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Pages 499-515 | Received 07 Feb 2003, Accepted 04 Mar 2003, Published online: 06 Feb 2007

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MadhavanS. Esayanur, SureshB. Yeruva, YakovI. Rabinovich & BrijM. Moudgil. (2005) Interaction force measurements using atomic force microscopy for characterization and control of adhesion, dispersion and lubrication in particulate systems. Journal of Adhesion Science and Technology 19:8, pages 611-626.
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Articles from other publishers (17)

Tao Li, Haoyang Sun, Daiqi Wang, Jintao Huang, Dandan Li, Fan Lei & Dazhi Sun. (2021) High-performance chemical mechanical polishing slurry for aluminum alloy using hybrid abrasives of zirconium phosphate and alumina. Applied Surface Science 537, pages 147859.
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Shenghua Yang, Baoguo Zhang, Chenwei Wang, Wenqian Zhang, Yuling Liu & Baohong Gao. (2018) Studies on Electrochemical Characteristics of SiGe in Application to Chemical Mechanical Polishing. ECS Journal of Solid State Science and Technology 7:5, pages P213-P220.
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Filip Ilie & George Ipate. (2017) Chemical-Mechanical Impact of Nanoparticles and pH Effect of the Slurry on the CMP of the Selective Layer Surfaces. Lubricants 5:2, pages 15.
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Zeynep Ozdemir, Valentin Craciun & Bahar Basim. (2015) Self-protective Oxide Nano-Coatings for Enhanced Surface Biocompatibility of Titanium. MRS Proceedings 1806, pages 7-12.
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Cathy E. McNamee & Ko Higashitani. (2013) Effect of the Charge and Roughness of Surfaces on Normal and Friction Forces Measured in Aqueous Solutions. Langmuir 29:16, pages 5013-5022.
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Ivan U. Vakarelski, Naofumi Teramoto, Cathy E. McNamee, Jeremy O. Marston & Ko Higashitani. (2012) Ionic Enhancement of Silica Surface Nanowear in Electrolyte Solutions. Langmuir 28:46, pages 16072-16079.
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G. Bahar Basim. (2011) Effect of slurry aging on stability and performance of chemical mechanical planarization process. Advanced Powder Technology 22:2, pages 257-265.
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Cecil A. Coutinho & Vinay K. Gupta. 2011. Applied Plastics Engineering Handbook. Applied Plastics Engineering Handbook 519 532 .
Ivan U. Vakarelski, Scott C. Brown, G. Bahar Basim, Yakov I. Rabinovich & Brij M. Moudgil. (2010) Tailoring Silica Nanotribology for CMP Slurry Optimization: Ca 2+ Cation Competition in C 12 TAB Mediated Lubrication . ACS Applied Materials & Interfaces 2:4, pages 1228-1235.
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Cecil A. Coutinho, Subrahmanya R. Mudhivarthi, Ashok Kumar & Vinay K. Gupta. (2008) Novel ceria–polymer microcomposites for chemical mechanical polishing. Applied Surface Science 255:5, pages 3090-3096.
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Bahar Basim, Ivan Vakarelski, Brij Moudgil & Scott Brown. 2008. Dekker Encyclopedia of Nanoscience and Nanotechnology, Second Edition - Six Volume Set (Print Version). Dekker Encyclopedia of Nanoscience and Nanotechnology, Second Edition - Six Volume Set (Print Version) 153 167 .
Elena Taran, Yoichi Kanda, Ivan U. Vakarelski & Ko Higashitani. (2007) Nonlinear friction characteristics between silica surfaces in high pH solution. Journal of Colloid and Interface Science 307:2, pages 425-432.
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Ruslan Burtovyy, Yong Liu, Bogdan Zdyrko, Alex Tregub, Mansour Moinpour, Mark Buehler & Igor Luzinov. (2007) AFM Measurements of Interactions Between CMP Slurry Particles and Substrate. Journal of The Electrochemical Society 154:6, pages H476.
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Elena Taran, Bogdan C. Donose, Ivan U. Vakarelski & Ko Higashitani. (2006) pH dependence of friction forces between silica surfaces in solutions. Journal of Colloid and Interface Science 297:1, pages 199-203.
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Bogdan C. Donose, Ivan U. Vakarelski & Ko Higashitani. (2005) Silica Surfaces Lubrication by Hydrated Cations Adsorption from Electrolyte Solutions. Langmuir 21:5, pages 1834-1839.
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Tae-Gun Kim, Nam-Hoon Kim, Sang-Yong Kim & Eui-Goo Chang. (2004) Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry. Transactions on Electrical and Electronic Materials 5:6, pages 233-236.
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Ivan U. Vakarelski, Scott C. Brown, Yakov I. Rabinovich & Brij M. Moudgil. (2004) Lateral Force Microscopy Investigation of Surfactant-Mediated Lubrication from Aqueous Solution. Langmuir 20:5, pages 1724-1731.
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