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Journal of Adhesion Science and Technology Volume 24, 2010 - Issue 6
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Preparation of a Nickel Ion Containing Langmuir–Blodgett Multilayer and an Ultra-Thin Nickel Film Deposited on an Interpenetrating Polymer Network Substrate

Dongyan Tang Department of Chemistry, School of Science, Harbin Institute of Technology, Harbin 150001, China;, Email: [email protected]
,
Ji Li Department of Chemistry, School of Science, Harbin Institute of Technology, Harbin 150001, China
&
Xiaohong Zhang College of Materials Science and Chemical Engineering, Harbin Engineering University, Harbin 150001, China
Pages 1055-1062 | Published online: 02 Apr 2012

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Jun-yi Sun, Jian-li Hu, Xiao-ting He, Zhou-lian Zheng & Huan-huan Geng. (2011) A Theoretical Study of Thin Film Delamination Using Clamped Punch-Loaded Blister Test: Energy Release Rate and Closed-Form Solution. Journal of Adhesion Science and Technology 25:16, pages 2063-2080.
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Articles from other publishers (2)

S. Sharma, M. Kumar, S. Rani, D. Kumar & C.C. Tripathi. (2016) Structural and electrical characterization of CoNiO monolayer as copper diffusion barrier in integrated circuits. Materials Science in Semiconductor Processing 48, pages 1-8.
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Sumit Sharma, Mukesh Kumar, Sumita Rani & Dinesh Kumar. (2016) Diffusion barrier characteristics of co monolayer prepared by Langmuir Blodgett technique. Applied Surface Science 369, pages 137-142.
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