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Articles

Adhesion Properties and Structure of Ion-Beam Modified Polyimide Films

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Pages 993-1000 | Published online: 02 Apr 2012

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Yu Xiang, Feng Lang, Fang Liu, Menglin Wei, Duxin Li & Yilan You. (2022) Structure and properties of polyimide/sericite composite adhesive prepared bypolyamide acid salt method. Journal of Adhesion Science and Technology 36:5, pages 531-544.
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Ligeng Shao, Liqun Du & Liding Wang. (2014) Enhancing the Adhesion Strength Between Cu Substrate and Ni Layer in Microelectroforming. Materials and Manufacturing Processes 29:7, pages 795-800.
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Articles from other publishers (5)

Yuan-Nan Tsai, Shih-Chieh Chin, Hsin-Yo Chen, Ta-I. Yang, Mei-Hui Tsai & I.-Hsiang Tseng. (2023) Sputtered anti-reflection layer on transparent polyimide substrate improves adhesion strength to copper layer: effects of layer thickness and sputtering power. RSC Advances 13:20, pages 13880-13885.
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Jin Hee Han, Bong Ho Kim, Soon Hyeong Kwon & Young Joon Yoon. (2019) Growth Behavior of SiO2 Films on Polyimide Substrates after Ion-Beam Treatment. Journal of the Korean Physical Society 75:8, pages 591-596.
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Gang Bai, Yanchun Liu & Hongfei Qian. (2018) Surface characteristics and dyeing properties of polyimide fabric treated with sodium hydroxide. Coloration Technology 135:1, pages 53-59.
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Po-Chiang Wang, Yih-Ming Liu, Chang-Pin Chang, Yeh-Yu Liao, You-Yu Peng & Ming-Der Ger. (2017) A laser curable palladium complex ink used for fabrication of copper pattern on polyimide substrate. Journal of the Taiwan Institute of Chemical Engineers 80, pages 963-969.
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Nabil Anagreh & Radwan Dweiri. (2014) Adhesion behavior of different annealed polyphenylquinoxaline foils treated using low pressure plasma. Journal of Applied Polymer Science 131:4, pages n/a-n/a.
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