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Articles

In situ cure monitoring of adhesively bonded joints by dielectrometry

Pages 2111-2130 | Published online: 02 Apr 2012

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Read on this site (4)

Do-Hyoung Kim & Hak-Sung Kim. (2013) Smart cure cycle to improve tensile load capability of the adhesively bonded joint. Journal of Adhesion Science and Technology 27:16, pages 1739-1754.
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Mary Teo. (2008) Novel Techniques for Characterization of Fast-Cure Anisotropic Conductive and Non-conductive Adhesives. Journal of Adhesion Science and Technology 22:8-9, pages 1003-1015.
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Hak Sung Kim & Dai Gil Lee. (2006) Avoidance of fabricational thermal residual stresses in co-cure bonded metal-composite hybrid structures. Journal of Adhesion Science and Technology 20:9, pages 959-979.
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G. D. Davis, S. Mani, M. J. Rich & L. T. Drzal. (2005) Electrochemical impedance spectroscopy inspection of composite adhesive joints. Journal of Adhesion Science and Technology 19:6, pages 467-492.
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Articles from other publishers (12)

Milan Šernek & Jure Žigon. 2023. Biobased Adhesives. Biobased Adhesives 255 278 .
Seong-Hwan Yoo, Min-Gu Han, Jin-Ho Hong & Seung-Hwan Chang. (2015) Simulation of curing process of carbon/epoxy composite during autoclave degassing molding by considering phase changes of epoxy resin. Composites Part B: Engineering 77, pages 257-267.
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Nam Soohyun, Lee Dongyoung, Choi Ilbeom & Lee Dai Gil. (2015) Smart cure cycle for reducing the thermal residual stress of a co-cured E-glass/carbon/epoxy composite structure for a vanadium redox flow battery. Composite Structures 120, pages 107-116.
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L H Garden, D Hayward & R A Pethrick. (2007) Dielectric non-destructive testing approach to cure monitoring of adhesives and composites. Proceedings of the Institution of Mechanical Engineers, Part G: Journal of Aerospace Engineering 221:4, pages 521-533.
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Woo Seok Chin & Dai Gil Lee. (2007) Laminating rule for predicting the dielectric properties of E-glass/epoxy laminate composite. Composite Structures 77:3, pages 373-382.
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Hak Sung Kim & Dai Gil Lee. (2007) Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry. Composites Science and Technology 67:1, pages 29-44.
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Wolf‐Dieter Hergeth. 2003. Ullmann's Encyclopedia of Industrial Chemistry. Ullmann's Encyclopedia of Industrial Chemistry.
Hak Sung Kim, Sang Wook Park & Dai Gil Lee. (2006) Smart cure cycle with cooling and reheating for co-cure bonded steel/carbon epoxy composite hybrid structures for reducing thermal residual stress. Composites Part A: Applied Science and Manufacturing 37:10, pages 1708-1721.
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Hak Sung Kim, Sang Wook Park, Hui Yun Hwang & Dai Gil Lee. (2006) Effect of the smart cure cycle on the performance of the co-cured aluminum/composite hybrid shaft. Composite Structures 75:1-4, pages 276-288.
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Jong Woon Kim, Ji Hyung Lee, Hyoung Geun Kim, Hak Sung Kim & Dai Gil Lee. (2006) Reduction of residual stresses in thick-walled composite cylinders by smart cure cycle with cooling and reheating. Composite Structures 75:1-4, pages 261-266.
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Gerd Habenicht. 2006. Kleben. Kleben 863 1024 .
Woo Seok Chin & Dai Gil Lee. (2005) Development of the trenchless rehabilitation process for underground pipes based on RTM. Composite Structures 68:3, pages 267-283.
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