Alessandro Leronni & Norman A. Fleck. (2023) Delamination growth of a sandwich layer by diffusion of a corrosive species. Journal of the Mechanics and Physics of Solids 172, pages 105179.
Crossref

Sina Askarinejad, Vikram Deshpande & Norman Fleck. (2022) Interfacial delamination of a sandwich layer by aqueous corrosion. Corrosion Science 203, pages 110356.
Crossref

İlknur Baylakoğlu, Aleksandra Fortier, San Kyeong, Rajan Ambat, Helene Conseil-Gudla, Michael H. Azarian & Michael G. Pecht. (2021) The detrimental effects of water on electronic devices. e-Prime - Advances in Electrical Engineering, Electronics and Energy 1, pages 100016.
Crossref

Taewi Kim, Taemin Lee, Gunhee Lee, Yong Choi, Sang Kim, Daeshik Kang & Mansoo Choi. (2018) Polyimide Encapsulation of Spider-Inspired Crack-Based Sensors for Durability Improvement. Applied Sciences 8:3, pages 367.
Crossref

Dong rong Xin & Qiang Han. (2014) Estimating interfacial interaction energy of Cu-epoxy resin from molecular dynamics simulation. Electronic Materials Letters 10:3, pages 535-539.
Crossref

Y. C. Lin & Jue Zhong. (2008) A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications. Journal of Materials Science 43:9, pages 3072-3093.
Crossref

D.C.C. Lam & J. Wang. (2007) Hygrothermal Delaminations in Lead-Free Solder Reflow of Electronic Packages. Journal of Electronic Materials 36:3, pages 226-231.
Crossref

Gerd Habenicht. 2006. Kleben. Kleben 863 1024 .

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Order Reprints Request Corporate Permissions

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

Request Academic Permissions

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.

Related research

People also read lists articles that other readers of this article have read.

Recommended articles lists articles that we recommend and is powered by our AI driven recommendation engine.

Cited by lists all citing articles based on Crossref citations.
Articles with the Crossref icon will open in a new tab.

People also read
Recommended articles
Cited by

To cite this article:

Reference style: APA Chicago Harvard

Citation copied to clipboard

Reference styles above use APA (6th edition), Chicago (16th edition) & Harvard (10th edition)

Download citation

Download a citation file in RIS format that can be imported by citation management software including EndNote, ProCite, RefWorks and Reference Manager.

Choose format: RIS BibTex RefWorks Direct Export

Choose options: Citation Citation & abstract Citation & references

The role of water in delamination in electronic packages: degradation of interfacial adhesion

Articles from other publishers (8)

Information for

Open access

Opportunities

Help and information

Your download is now in progress and you may close this window

Login or register to access this feature