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Journal of Adhesion Science and Technology Volume 18, 2004 - Issue 11
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The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part I: the effects of adhesive thickness

Rajesh R. Gomatam
&
Erol Sancaktar
Pages 1225-1243 | Published online: 02 Apr 2012

Citations (13)

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Naoaki Tsurumi, Yuta Tsuji, Taiki Baba, Hiroyuki Murata, Noriyuki Masago & Kazunari Yoshizawa. (2022) Comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives. The Journal of Adhesion 98:1, pages 24-48.
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Jianguo Zhou & Erol Sancaktar. (2010) Yield Behavior of Moderately Filled Epoxy/Ni Suspensions. Journal of Adhesion Science and Technology 24:11-12, pages 1929-1948.
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Yung-Sen Lin & Sheng-Shiang Chiu. (2008) Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles. Journal of Adhesion Science and Technology 22:14, pages 1673-1697.
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Jianguo Zhou & Erol Sancaktar. (2008) Chemorheology of Epoxy/Nickel Conductive Adhesives During Processing and Cure. Journal of Adhesion Science and Technology 22:8-9, pages 957-981.
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Jianguo Zhou & Erol Sancaktar. (2008) Geometric Effects on Multilayer Generic Circuits Fabricated Using Conductive Epoxy/Nickel Adhesives. Journal of Adhesion Science and Technology 22:8-9, pages 947-956.
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Jianguo Zhou & Erol Sancaktar. (2008) Stable and Unstable Capillary Flows of Highly-Filled Epoxy/Nickel Suspensions. Journal of Adhesion Science and Technology 22:8-9, pages 983-1002.
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Kyu Dong Kim & D. D. L. Chung. (2005) Electrically conductive adhesive and soldered joints under compression. Journal of Adhesion Science and Technology 19:11, pages 1003-1023.
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W. T. Cheng, Y. W. Chih & C. W. Lin. (2005) Formulation and characterization of UV-light-curable electrically conductive pastes. Journal of Adhesion Science and Technology 19:7, pages 511-523.
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Huann-Wu Chiang, Cho-Liang Chung, Liu-Chin Chen, Yi Li, C. P. Wong & Shen-Li Fu. (2005) Processing and shape effects on silver paste electrically conductive adhesives (ECAs). Journal of Adhesion Science and Technology 19:7, pages 565-578.
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Articles from other publishers (4)

C. Mette, E. Stammen & K. Dilger. (2016) Challenges in joining conductive adhesives in structural application – Effects of tolerances and temperature. International Journal of Adhesion and Adhesives 67, pages 49-53.
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Erol Sancaktar & Lan Bai. (2011) Electrically Conductive Epoxy Adhesives. Polymers 3:1, pages 427-466.
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Wen-Tung Cheng, Yu-Wen Chih & Wei-Ting Yeh. (2007) In situ fabrication of photocurable conductive adhesives with silver nano-particles in the absence of capping agent. International Journal of Adhesion and Adhesives 27:3, pages 236-243.
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Gerd Habenicht. 2006. Kleben. Kleben 863 1024 .

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