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Journal of Adhesion Science and Technology Volume 18, 2004 - Issue 8
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Research Articles

Fatigue and failure behavior of silver-filled electronically-conductive adhesive joints subjected to elevated temperatures

Rajesh R. Gomatam
&
Erol Sancaktar
Pages 849-881 | Published online: 02 Apr 2012

Citations (19)

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Read on this site (10)

A. L. Loureiro, LucasF. M. da Silva, Chiaki Sato & M. A. V. Figueiredo. (2010) Comparison of the Mechanical Behaviour Between Stiff and Flexible Adhesive Joints for the Automotive Industry. The Journal of Adhesion 86:7, pages 765-787.
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Jianguo Zhou & Erol Sancaktar. (2010) Yield Behavior of Moderately Filled Epoxy/Ni Suspensions. Journal of Adhesion Science and Technology 24:11-12, pages 1929-1948.
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Jianguo Zhou & Erol Sancaktar. (2008) Chemorheology of Epoxy/Nickel Conductive Adhesives During Processing and Cure. Journal of Adhesion Science and Technology 22:8-9, pages 957-981.
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Jianguo Zhou & Erol Sancaktar. (2008) Geometric Effects on Multilayer Generic Circuits Fabricated Using Conductive Epoxy/Nickel Adhesives. Journal of Adhesion Science and Technology 22:8-9, pages 947-956.
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Jianguo Zhou & Erol Sancaktar. (2008) Stable and Unstable Capillary Flows of Highly-Filled Epoxy/Nickel Suspensions. Journal of Adhesion Science and Technology 22:8-9, pages 983-1002.
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RajeshR. Gomatam & Erol Sancaktar. (2006) A comprehensive fatigue life predictive model for electronically conductive adhesive joints under constant-cycle loading. Journal of Adhesion Science and Technology 20:1, pages 87-104.
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RajeshR. Gomatam & Erol Sancaktar. (2006) A novel cumulative fatigue damage model for electronically-conductive adhesive joints under variable loading. Journal of Adhesion Science and Technology 20:1, pages 69-86.
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RajeshR. Gomatam & Erol Sancaktar. (2006) The effects of stress state, loading frequency and cyclic waveforms on the fatigue behavior of silver-filled electronically-conductive adhesive joints. Journal of Adhesion Science and Technology 20:1, pages 53-68.
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RajeshR. Gomatam & Erol Sancaktar. (2005) Effects of various adherend surface treatments on fatigue behavior of joints bonded with a silver-filled electronically conductive adhesive. Journal of Adhesion Science and Technology 19:8, pages 659-678.
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RajeshR. Gomatam & Erol Sancaktar. (2004) Fatigue and failure behaviors of silver-filled electronically-conductive adhesive joints subjected to elevated humidity. Journal of Adhesion Science and Technology 18:15-16, pages 1833-1848.
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Articles from other publishers (9)

Xiaoguang Huang, Yichao Wang, Qihui Zhu, Zhongzhe Du, Longchi Zhou & Hehe Liu. (2023) Thermal creep and fatigue failure of the sintered silver solder in a SiC-IGBT module under power cycling. Engineering Failure Analysis 154, pages 107625.
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Yangning Tian, Xiaodong Jian, Mingrui Zhao, Jiahao Liu, Xuanjun Dai, Bin Zhou & Xiaofeng Yang. (2023) Effect of Thermal Aging on the Reliability of Interconnected Nano-Silver Solder Joints. Crystals 13:12, pages 1630.
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Francis M.G. Ramírez, Marcelo F.S.F. de Moura, Raul D.F. Moreira & Filipe G.A. Silva. (2020) A review on the environmental degradation effects on fatigue behaviour of adhesively bonded joints. Fatigue & Fracture of Engineering Materials & Structures 43:7, pages 1307-1326.
Crossref
M. Kemal Apalak. 2017. Progress in Adhesion and Adhesives. Progress in Adhesion and Adhesives 271 320 .
B. Ozturk, A. Youssef, P. Gromala, C. Silber, K.M.B. Jansen & L.J. Ernst. (2014) A product based lap shear fatigue testing of electrically conductive adhesives. A product based lap shear fatigue testing of electrically conductive adhesives.
D. Thevenet, R. Créac’hcadec, L. Sohier & J.Y. Cognard. (2013) Experimental analysis of the behavior of adhesively bonded joints under tensile/compression–shear cyclic loadings. International Journal of Adhesion and Adhesives 44, pages 15-25.
Crossref
Erol Sancaktar & Lan Bai. (2011) Electrically Conductive Epoxy Adhesives. Polymers 3:1, pages 427-466.
Crossref
V. Khuu, M. Osterman, A. Bar-Cohen & M. Pecht. (2009) Effects of Temperature Cycling and Elevated Temperature/Humidity on the Thermal Performance of Thermal Interface Materials. IEEE Transactions on Device and Materials Reliability 9:3, pages 379-391.
Crossref
Gerd Habenicht. 2006. Kleben. Kleben 863 1024 .

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