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Articles

Electrochemical impedance evaluation of aluminum/boron–epoxy composite bonds

Pages 1397-1408 | Published online: 02 Apr 2012

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G. D. Davis, R. A. Pethrick & J. Doyle. (2009) Detection of Moisture in Adhesive Bonds Using Electrochemical Impedance and Dielectric Spectroscopies. Journal of Adhesion Science and Technology 23:4, pages 507-528.
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Articles from other publishers (2)

Brian R. Stoner, Jeffrey R. Piascik, Billyde Brown & Scott D. Wolter. (2011) A novel array chip to monitor in situ composite degradation using electrochemical impedance spectroscopy. Dental Materials 27:8, pages 811-817.
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Jiankang Chen, Wencai Wang, Ji Wang, Zengtao Yang & Jiashi Yang. (2008) A thickness mode acoustic wave sensor for measuring interface stiffness between two elastic materials. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 55:8, pages 1678-1681.
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