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Journal of Adhesion Science and Technology Volume 20, 2006 - Issue 15
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Articles

Analysis of stresses in adhesive joints applicable to IC chips using symbolic manipulation and the numerical method

Tung-Hua Cheng
,
Ching-Huan Tseng
&
Ching-Hua Hung
Pages 1669-1692 | Published online: 02 Apr 2012

Citations (17)

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Read on this site (3)

Jinhua Hong, Jiankui Chen, Zhoulong Xu & Zhouping Yin. (2018) Reliable thin chip peeling from adhesive tape with inverted needle ejecting and spring buffering. Journal of Adhesion Science and Technology 32:7, pages 753-771.
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Zhoulong Xu, Zunxu Liu, YongAn Huang, Jiankui Chen, Huimin Liu & Zhouping Yin. (2015) Vacuum-based picking-up of thin chip from adhesive tape. Journal of Adhesion Science and Technology 29:13, pages 1315-1329.
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Tung-Hua Cheng, Ching-Huan Tseng & Ching-Hua Hung. (2008) Application of a Genetic Algorithm Associated With Adhesive Joint Analysis to the IC Chip Pick-up Process. Journal of Adhesion Science and Technology 22:10-11, pages 1057-1072.
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Articles from other publishers (14)

Jinping Fu, Wei Du, Huiming Hou, Xiaohua Zhao & Tao Wu. (2023) Dynamic peeling process of IC chip from substrate based on a 3D analytical model. International Journal of Solids and Structures 279, pages 112374.
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Jinhua Hong, Wei Chen, Jinhong Guo, Peng Cheng, Yulong Li & Wentao Dong. (2022) Theoretical and experimental studies of spring-buffer chip peeling technology for electronics packaging. International Journal of Fracture 236:1, pages 109-124.
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Siyu Chen, Wenhan Lyu, Gang Wang, Ying Chen, Yinji Ma & Xue Feng. (2021) Mechanics analysis of ultra-thin chip peeling from substrate under multi-needle-ejecting and vacuum-absorbing. International Journal of Solids and Structures 224, pages 111009.
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YongAn Huang, Zhouping Yin & Xiaodong WanYongAn Huang, Zhouping Yin & Xiaodong Wan. 2019. Modeling and Application of Flexible Electronics Packaging. Modeling and Application of Flexible Electronics Packaging 1 27 .
Zunxu Liu, Xiaodong Wan, YongAn Huang, Jiankui Chen & Zhouping Yin. (2018) Theoretical and Experimental Studies of Competing Fracture for Flexible Chip-Adhesive-Substrate Composite Structure. IEEE Transactions on Components, Packaging and Manufacturing Technology 8:1, pages 57-64.
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Zhoulong Xu, Zunxu Liu, Huimin Liu, Zhouping Yin, Yongan Huang & Jiankui Chen. (2015) Analytical Evaluation of Interfacial Crack Propagation in Vacuum-Based Picking-up Process. IEEE Transactions on Components, Packaging and Manufacturing Technology 5:11, pages 1700-1708.
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Huimin Liu, Zunxu Liu, Zhoulong Xu, Zhouping Yin, YongAn Huang & Jiankui Chen. (2015) Competing Fracture of Thin-Chip Transferring From/Onto Prestrained Compliant Substrate. Journal of Applied Mechanics 82:10.
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Huiqiang Shen, Lezhi Ye, Liang Tang & Ziyang Liu. (2015) Study on thin die pick-up process based on Taguchi method. Study on thin die pick-up process based on Taguchi method.
Zunxu Liu, Yong An Huang, Huimin Liu, Jiankui Chen & Zhouping Yin. (2014) Reliable Peeling of Ultrathin Die With Multineedle Ejector. IEEE Transactions on Components, Packaging and Manufacturing Technology 4:9, pages 1545-1554.
Crossref
Zunxu Liu, YongAn Huang, Jiankui Chen & Zhouping Yin. (2014) Tunable Peeling Technique and Mechanism of Thin Chip From Compliant Adhesive Tapes. IEEE Transactions on Components, Packaging and Manufacturing Technology 4:4, pages 560-568.
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Bo Peng, Yongan Huang, Zhouping Yin & Youlun Xiong. (2012) Competing Fracture Modeling of Thin Chip Pick-Up Process. IEEE Transactions on Components, Packaging and Manufacturing Technology 2:7, pages 1217-1225.
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Bo Peng, YongAn Huang, ZhouPing Yin & YouLun Xiong. (2011) Analysis of interfacial peeling in IC chip pick-up process. Journal of Applied Physics 110:7.
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Bo Peng, YongAn Huang, ZhouPing Yin & YouLun Xiong. (2011) On the analysis of dynamic effect in the die pick-up process. On the analysis of dynamic effect in the die pick-up process.
Naoya Saiki, Kazuaki Inaba, Kikuo Kishimoto, Hideo Seno & Kazuhiro Takahashi. (2011) Investigation of the Correlation between IC Chip Pick-Up Performance and Peeling Behavior of Adhesive Tapes. Key Engineering Materials 462-463, pages 807-811.
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