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Journal of Adhesion Science and Technology Volume 22, 2008 - Issue 8-9: Electrically Conductive Adhesives Part 1
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Articles

Geometric Effects on Multilayer Generic Circuits Fabricated Using Conductive Epoxy/Nickel Adhesives

Jianguo Zhou Department of Polymer Engineering, University of Akron, Akron, OH 44325-0301, USA
&
Erol Sancaktar Department of Polymer Engineering, University of Akron, Akron, OH 44325-0301, USA;, Email: [email protected]
Pages 947-956 | Published online: 02 Apr 2012

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Read on this site (1)

Qingyan Shang, Sue Hao, Weili Wang, Dongsheng Fu & Tianlong Ma. (2013) Preparation and characterization of antistatic coatings with modified BaTiO3 powders as conductive fillers. Journal of Adhesion Science and Technology 27:24, pages 2642-2652.
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Articles from other publishers (4)

Hongyu Dong, Xin Li, Yi Dong, Shaoqing Guo & Liangfu Zhao. (2019) A Novel Preparation Method of Electrically Conductive Adhesives by Powder Spraying Process. Materials 12:17, pages 2793.
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Kunio Shimada, Hiroshige Kikura, Hideharu Takahashi & Ryo Ikeda. (2019) Novel Adhesion Technique Using Metallic or Non-Metallic Hydrous Oxide of Metal Complexes Involving Magnetic Compound Fluid Rubber under Electrolytic Polymerization and Magnetic Field for Producing Sensors. Sensors 19:3, pages 689.
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Yunjiao Li, Sue Hao, Fangwei Wang, Xinrong Liu & Xianwei Meng. (2014) Investigation on relationship among calcination temperature, grain size, Mn valence and resistivity of Ca0.75Er0.25MnO3?? powders. Journal of Materials Science: Materials in Electronics 26:1, pages 176-184.
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Erol Sancaktar & Lan Bai. (2011) Electrically Conductive Epoxy Adhesives. Polymers 3:1, pages 427-466.
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