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Journal of Adhesion Science and Technology Volume 22, 2008 - Issue 8-9: Electrically Conductive Adhesives Part 1
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Articles

Recent Advances in Developing High Performance Isotropic Conductive Adhesives

Daoqiang Daniel Lu Intel Corporation, 5000 W. Chandler Blvd, Chandler, AZ 85226, USA
&
C. P. Wong School of Materials Science and Engineering and Packaging Research Center, Georgia Institute of Technology, Atlanta, GA 30332-0245
Pages 835-851 | Published online: 02 Apr 2012

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Z. X. Zhang, X. Y. Chen & F. Xiao. (2011) The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires. Journal of Adhesion Science and Technology 25:13, pages 1465-1480.
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Articles from other publishers (10)

Weiwei Zhang, Zheng Zhang, Hao Liu, Jianqiang Wang, Fangcheng Duan, Ziwen Lv, Wentong Chen, Xinjie Wang, Mingyu Li, Chuantong Chen & Hongtao Chen. (2023) Effects of low melting point SnBi58 alloy on the properties of isotropic conductive adhesives. International Journal of Adhesion and Adhesives, pages 103419.
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Jian Hao, Xinyue He, Saipeng Li, Jian Zhou & Feng Xue. (2017) The effect of curing agent on the properties of silver paste Electrically Conductive Adhesives(ECAs). The effect of curing agent on the properties of silver paste Electrically Conductive Adhesives(ECAs).
Yan-Hong Ji, Yu Liu, Gui-Wen Huang, Xiao-Jun Shen, Hong-Mei Xiao & Shao-Yun Fu. (2015) Ternary Ag/Epoxy Adhesive with Excellent Overall Performance. ACS Applied Materials & Interfaces 7:15, pages 8041-8052.
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Byung-Seung Yim, Byung Hun Lee, Jooheon Kim & Jong-Min Kim. (2014) Effect of dispersion condition of multi-walled carbon nanotube (MWNT) on bonding properties of solderable isotropic conductive adhesives (ICAs). Journal of Materials Science: Materials in Electronics 25:12, pages 5208-5217.
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Xiao Peng, Fatang Tan, Wei Wang, Xiaolin Qiu, Fazhe Sun, Xueliang Qiao & Jianguo Chen. (2014) Conductivity improvement of silver flakes filled electrical conductive adhesives via introducing silver–graphene nanocomposites. Journal of Materials Science: Materials in Electronics 25:3, pages 1149-1155.
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Kai Zhong, George Peabody, Elizabeth Blankenhorn, Howard Glicksman & Sheryl Ehrman. (2013) Spray pyrolysis of phase pure AgCu particles using organic cosolvents. Journal of Materials Research 28:19, pages 2753-2761.
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Shilong Chen, Konghua Liu, Yuanfang Luo, Demin Jia, Hong Gao, Guojun Hu & Lan Liu. (2013) In situ preparation and sintering of silver nanoparticles for low-cost and highly reliable conductive adhesive. International Journal of Adhesion and Adhesives 45, pages 138-143.
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Byung-Seung Yim, Seung Hoon Oh, Jin Sik Jeong & Jong-Min Kim. (2012) Self-interconnection characteristics of hybrid composite with low-melting-point alloy fillers. Journal of Composite Materials 47:9, pages 1141-1152.
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Li-Lan Gao, Xu Chen & Hong Gao. (2012) Mechanical Properties of Anisotropic Conductive Adhesive Film Under Hygrothermal Aging and Thermal Cycling. Journal of Electronic Materials 41:7, pages 2001-2009.
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Rongwei Zhang, Wei Lin, Kevin Lawrence & C.P. Wong. (2010) Highly reliable, low cost, isotropically conductive adhesives filled with Ag-coated Cu flakes for electronic packaging applications. International Journal of Adhesion and Adhesives 30:6, pages 403-407.
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