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Journal of Adhesion Science and Technology Volume 22, 2008 - Issue 16
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Articles

Improvement of Adhesion Between Liquid Crystalline Polyester Films by Plasma Treatment

Yasuhiro Kurihara Graduate School of Environmental Science, Okayama University, 3-1-1 Tsushima-naka, Okayama 700-8530, Japan, Japan Gore-Tex Inc., 1102-4 Mitsu Kouchi, Okayama 709-2123, Japan;, Email: [email protected]
,
Hiroyuki Ohata Japan Gore-Tex Inc., 1102-4 Mitsu Kouchi, Okayama 709-2123, Japan
,
Masahiko Kawaguchi Japan Gore-Tex Inc., 1102-4 Mitsu Kouchi, Okayama 709-2123, Japan
,
Shinichi Yamazaki Graduate School of Environmental Science, Okayama University, 3-1-1 Tsushima-naka, Okayama 700-8530, Japan
&
Kunio Kimura Graduate School of Environmental Science, Okayama University, 3-1-1 Tsushima-naka, Okayama 700-8530, Japan
Pages 1985-2002 | Published online: 02 Apr 2012

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Read on this site (1)

Narendiran Vitchuli, Quan Shi, Joshua Nowak, Rupesh Nawalakhe, Michael Sieber, Mohamed Bourham, Xiangwu Zhang & Marian McCord. (2013) Atmospheric plasma application to improve adhesion of electrospun nanofibers onto protective fabric. Journal of Adhesion Science and Technology 27:8, pages 924-938.
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Articles from other publishers (3)

Wenqing Wang, Jacob Meyer, Qingxuan Zeng, Mingyu Li, Bita Vaezian & James Economy. (2016) Adhesion characteristics of aromatic thermosetting copolyester and glass fiber laminates with copper foils for improved circuit boards. Polymers for Advanced Technologies 27:12, pages 1577-1585.
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Narendiran Vitchuli, Quan Shi, Joshua Nowak, Rupesh Nawalakhe, Michael Sieber, Mohamed Bourham, Marian McCord & Xiangwu Zhang. (2011) Plasma-Electrospinning Hybrid Process and Plasma Pretreatment to Improve Adhesive Properties of Nanofibers on Fabric Surface. Plasma Chemistry and Plasma Processing 32:2, pages 275-291.
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Mohammad K. Chowdhury, Li Sun, Shawn Cunningham & Ajay P. Malshe. (2010) Investigation of chemical de-burring and subsequent plasma cleaning of mechanically punched micro via array fabricated in LCP substrate. Investigation of chemical de-burring and subsequent plasma cleaning of mechanically punched micro via array fabricated in LCP substrate.

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