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Transactions of the IMF
The International Journal of Surface Engineering and Coatings
Volume 88, 2010 - Issue 4
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Articles

Electroless deposition of copper from methane sulphonate complexed bath

S. RekhaRMD Engineering CollegeRSM Nagar, Kavaraipettai, Chennai601206, Tamil Nadu, India
,
K. N. SrinivasanCentral Electrochemical Research Institute Karaikudi630006, Tamil Nadu, India
&
S. JohnCentral Electrochemical Research Institute Karaikudi630006, Tamil Nadu, India
Pages 215-219 | Published online: 18 Jul 2013

Citations (5)

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Read on this site (3)

P. Balaramesh, P. Venkatesh & S. Rekha. (2014) Influence of imidazole and benzotriazole on electroless copper plating. Surface Engineering 30:8, pages 552-556.
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N Pewnim & S Roy. (2011) Effect of fluorosurfactant on copper–tin reduction from methanesulphonic acid electrolyte. Transactions of the IMF 89:4, pages 206-209.
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Clive Larson. (2011) Editorial. Transactions of the IMF 89:3, pages 113-113.
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Articles from other publishers (2)

Frank C. Walsh & Carlos Ponce de León. (2014) Versatile electrochemical coatings and surface layers from aqueous methanesulfonic acid. Surface and Coatings Technology 259, pages 676-697.
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N. Pewnim & S. Roy. (2013) Electrodeposition of tin-rich Cu–Sn alloys from a methanesulfonic acid electrolyte. Electrochimica Acta 90, pages 498-506.
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