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Transactions of the IMF
The International Journal of Surface Engineering and Coatings
Volume 88, 2010 - Issue 5
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Articles

Influence of additives and pulse parameters on uniformity of through-hole copper plating

Z.X. WangKey Laboratory of Applied Surface and Colloid ChemistryMinistry of Education, and School of Chemistry and Materials Science, Shaanxi Normal University, Xi'an710062, China
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S. WangKey Laboratory of Applied Surface and Colloid ChemistryMinistry of Education, and School of Chemistry and Materials Science, Shaanxi Normal University, Xi'an710062, China
,
Z. YangKey Laboratory of Applied Surface and Colloid ChemistryMinistry of Education, and School of Chemistry and Materials Science, Shaanxi Normal University, Xi'an710062, China
&
Z.L. WangKey Laboratory of Applied Surface and Colloid ChemistryMinistry of Education, and School of Chemistry and Materials Science, Shaanxi Normal University, Xi'an710062, China;, Email: [email protected]
Pages 272-276 | Published online: 18 Jul 2013

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Read on this site (3)

C Larson & J P G Farr*. (2012) Current research and potential applications for pulsed current electrodeposition – a review. Transactions of the IMF 90:1, pages 20-29.
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N Fukumuro, T Adachi, S Yae, H Matsuda & Y Fukai. (2011) Influence of hydrogen on room temperature recrystallisation of electrodeposited Cu films: thermal desorption spectroscopy. Transactions of the IMF 89:4, pages 198-201.
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M Gu & Q Zhong. (2011) Influence of MPS concentration on copper electrocrystallisation from acidic sulphate electrolyte with MPS additive systems. Transactions of the IMF 89:4, pages 187-193.
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Articles from other publishers (9)

Penghui Ren, Maozhong An, Peixia Yang & Jinqiu Zhang. (2022) Revealing the acceleration effect of SPS and Cl - on copper Surface: Instantaneous nucleation and Multi-Step energy change. Applied Surface Science 583, pages 152523.
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Yongfei Zhao, Shuangqing Qian, Yong Zhang, Xiaofeng Wan & Hua Zhang. (2021) Experimental study on uniformity of copper layer with microstructure arrays by electroforming. The International Journal of Advanced Manufacturing Technology 114:7-8, pages 2019-2030.
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A. A. Kosarev, A. A. Kalinkina, S. S. Kruglikov, T. A. Vagramyan & V. E. Kasatkin. (2021) Effect of the macro- and microthrowing power of the electrolyte on the uniformity of distribution of electroplated copper in through-holes for PCB. Journal of Solid State Electrochemistry 25:5, pages 1491-1501.
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Jing Xiang, Yuanming Chen, Shouxu Wang, Chong Wang, Wei He, Huaiwu Zhang, Xiaofeng Jin, Qingguo Chen & Xinhong Su. (2018) Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation. Circuit World 44:3, pages 150-160.
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Jing Xiang, Shouxu Wang, Jing Li, Wei He, Chong Wang, Yuanming Chen, Huaiwu Zhang, Hua Miao, Jinqun Zhou & Xiaofeng Jin. (2018) Electrochemical Factors of Levelers on Plating Uniformity of Through-Holes: Simulation and Experiments. Journal of The Electrochemical Society 165:9, pages E359-E365.
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Jing Xiang, Chong Wang, Yuanming Chen, Shouxu Wang, Yan Hong, Huaiwu Zhang, Lijun Gong & Wei He. (2017) Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates. Applied Surface Science 411, pages 82-90.
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Hiroki Yoshida, Takaaki Yamazaki, Takayoshi Adachi, Naoki Fukumuro, Shinji Yae & Yuh Fukai. (2015) Hydrogen-Induced Grain Growth in Electrodeposited Cu Films. Journal of the Japan Institute of Metals Journal of the Japan Institute of Metals and Materials 79:3, pages 78-81.
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Yuanming Chen, Wei He, Xianming Chen, Chong Wang, Zhihua Tao, Shouxu Wang, Guoyun Zhou & Mohamed Moshrefi-Torbati. (2014) Plating Uniformity of Bottom-up Copper Pillars and Patterns for IC Substrates with Additive-assisted Electrodeposition. Electrochimica Acta 120, pages 293-301.
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Mahmood AliofkhazraeiMahmood Aliofkhazraei. 2011. Nanocoatings. Nanocoatings 149 184 .

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