Development of novel electroplating tank layout by computer simulations and verification tests

K. T. LaitinenDepartment of Applied PhysicsUniversity of Eastern Finland, Kuopio, Finland;School of Engineering and TechnologySavonia University of Applied Sciences, Kuopio, FinlandCorrespondence[email protected]

J. M. MiettinenSchool of Engineering and TechnologySavonia University of Applied Sciences, Kuopio, Finland;Present address: Savroc Ltd Kuopio, Finland

M. VauhkonenDepartment of Applied PhysicsUniversity of Eastern Finland, Kuopio, Finland

R. LappalainenDepartment of Applied PhysicsUniversity of Eastern Finland, Kuopio, Finland

Citations (6)

Keep up to date with the latest research on this topic with citation updates for this article.

Read on this site (3)

S. M. J. S. Shourije & M. E. Bahrololoom. (2020) Comparison of effects of simulated electric field interference and presence of a barrier in the nickel electroplating process to experimental data. Transactions of the IMF 98:6, pages 303-313.
Read now

J. Yang, A. Li, X. Zhu, X. Liu & Z. Shen. (2020) Numerical study on the hydrodynamic performance of a novel electroplating cell with jet array and crossflow. Transactions of the IMF 98:1, pages 42-47.
Read now

J. R. Smith & C. Larson. (2016) Statistical approaches in surface finishing. Part 1. Introductory review and parametric hypothesis testing. Transactions of the IMF 94:6, pages 288-293.
Read now

Articles from other publishers (3)

Jinjin Wei, Peili Shi, Guannan Cui, Xin Li, Minke Xu, Dongyao Xu & Yunfeng Xie. (2023) Analysis of soil pollution characteristics and influencing factors based on ten electroplating enterprises. Environmental Pollution 337, pages 122562.
Crossref

Dehua Chen, Haneen Daoud, Thomas Dörflinger, Peter Näser, Ute Smuda, Jürgen Herlan & Uwe Glatzel. (2023) Simulation assisted design and manufacturing of anode for the hard chrome plating of components with complex geometry. Surface and Coatings Technology 455, pages 129178.
Crossref

Jing Xiang, Yuanming Chen, Shouxu Wang, Chong Wang, Wei He, Huaiwu Zhang, Xiaofeng Jin, Qingguo Chen & Xinhong Su. (2018) Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation. Circuit World 44:3, pages 150-160.
Crossref

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Order Reprints Request Corporate Permissions

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

Request Academic Permissions

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.

Development of novel electroplating tank layout by computer simulations and verification tests

Articles from other publishers (3)

Information for

Open access

Opportunities

Help and information

Your download is now in progress and you may close this window

Login or register to access this feature

Development of novel electroplating tank layout by computer simulations and verification tests

Citations (6)

Read on this site (3)

Articles from other publishers (3)

Reprints and Corporate Permissions

Academic Permissions

Related research

To cite this article:

Download citation

Information for

Open access

Opportunities

Help and information

Keep up to date