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Paweł Górecki, Adrian Pietruszka, Agata Skwarek & Balázs Illés. (2023)
Reliability tests of the surface-mounted power MOSFETs soldered using SAC0307-TiO
2
composite solder paste
.
Reliability tests of the surface-mounted power MOSFETs soldered using SAC0307-TiO
2
composite solder paste
.
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Bingyang Gao, Enyu Guo, Xiangrui Meng, Shuang Nie, Hui Liang, Zhiqiang Cao & Tongmin Wang. (2019) Grain nucleation and growth behavior of (Cu, Ni)6Sn5 in Sn–10Cu–1Ni alloy under pulse current: An in situ observation. Materials Characterization 158, pages 109969.
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Asit Kumar Gain & Liangchi Zhang. (2019) Temperature and humidity effects on microstructure and mechanical properties of an environmentally friendly Sn–Ag–Cu material. Journal of Materials Science 54:19, pages 12863-12874.
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Abdullah Fahim, Kamrul Hasan, Sudan Ahmed, Jeffrey C. Suhling & Pradeep Lall. (2019) Mechanical Behavior Evolution of SAC305 Lead Free Solder Joints under Thermal Cycling. Mechanical Behavior Evolution of SAC305 Lead Free Solder Joints under Thermal Cycling.
Asit Kumar Gain & Liangchi Zhang. (2019)
Nanosized samarium oxide (Sm
2
O
3
) particles suppressed the IMC phases and enhanced the shear strength of environmental-friendly Sn–Ag–Cu material
. Materials Research Express 6:6, pages 066526.
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