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S. Terashima, T. Kobayashi & M. Tanaka. (2008) Effect of crystallographic anisotropy of β-tin grains on thermal fatigue properties of Sn–1Ag–0˙5Cu and Sn–3Ag–0˙5Cu lead free solder interconnects. Science and Technology of Welding and Joining 13:8, pages 732-738.
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Shihai Tan, Jing Han, Yan Wang & Fu Guo. (2018) A method to determine the slip systems in BGA lead-free solder joints during thermal fatigue. Journal of Materials Science: Materials in Electronics 29:9, pages 7501-7509.
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Ping Chen, Xiuchen Zhao, Yong Wang, Bing Zheng, Chengliang Liu & Siqi Chen. (2015) Effect of nano α-Fe2O3 additions on physical and mechanical properties of Sn–1.0Ag–0.7Cu–xFe2O3 low Ag lead-free solders. Journal of Materials Science: Materials in Electronics 27:2, pages 1507-1519.
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Qingke ZhangQingke Zhang. 2016. Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces. Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
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Tingbi Luo, Zhuo Chen, Anmin Hu & Ming Li. (2012) Study on melt properties, microstructure, tensile properties of low Ag content Sn–Ag–Zn Lead-free solders. Materials Science and Engineering: A 556, pages 885-890.
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Dhafer Abdulameer Shnawah, Suhana Binti Mohd Said, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin & Fa Xing Che. (2012) High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications. Journal of Electronic Materials 41:9, pages 2631-2658.
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Bo Wang, Jiajun Li, Anthony Gallagher, James Wrezel, Pongpinit Towashirporn & Naiqin Zhao. (2012) Drop impact reliability of Sn–1.0Ag–0.5Cu BGA interconnects with different mounting methods. Microelectronics Reliability 52:7, pages 1475-1482.
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Dhafer Abdulameer Shnawah, Mohd Faizul Mohd Sabri & Irfan Anjum Badruddin. (2012) A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products. Microelectronics Reliability 52:1, pages 90-99.
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S. Terashima, T. Kohno, A. Mizusawa, K. Arai, O. Okada, T. Wakabayashi, M. Tanaka & K. Tatsumi. (2008) Improvement of Thermal Fatigue Properties of Sn-Ag-Cu Lead-Free Solder Interconnects on Casio’s Wafer-Level Packages Based on Morphology and Grain Boundary Character. Journal of Electronic Materials 38:1, pages 33-38.
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