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Transactions of the IMF
The International Journal of Surface Engineering and Coatings
Volume 85, 2007 - Issue 1
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Articles

Pulse plating of sacrificial Mn–Cu alloys from sulphate bath

F. Mangolini
,
L. Magagnin
&
P. L. Cavallotti
Pages 27-33 | Published online: 18 Jul 2013

Citations (7)

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Read on this site (3)

P. Berçot. (2008) Basic analysis of transient curve on electroplating phenomena. Transactions of the IMF 86:6, pages 337-341.
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J. P. G. Farr. (2008) Future pulse plating of silver. Transactions of the IMF 86:5, pages 275-279.
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S. Roy. (2008) Mass transfer considerations during pulse plating. Transactions of the IMF 86:2, pages 87-91.
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Articles from other publishers (4)

So-Young Joo, Yunju Choi & Heon-Cheol Shin. (2022) Hierarchical multi-porous copper structure prepared by dealloying electrolytic copper-manganese alloy. Journal of Alloys and Compounds 900, pages 163423.
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Tao Liu, Jinling Wang, Xuejing Yang & Ming Gong. (2021) A review of pulse electrolysis for efficient energy conversion and chemical production. Journal of Energy Chemistry 59, pages 69-82.
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Thaís Machado de Souza, Dalva Cristina Baptista do Lago & Lilian Ferreira de Senna. (2019) Electrodeposition of Co-rich Cu-Co Alloys from Sodium Tartrate Baths Using Direct (DC) and Single Pulsed Current (SPC). Materials Research 22:3.
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M.S. Chandrasekar & Malathy Pushpavanam. (2008) Pulse and pulse reverse plating—Conceptual, advantages and applications. Electrochimica Acta 53:8, pages 3313-3322.
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