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A. O. Gezerman & B. D. Çorbacıoğlu. (2015) Development of alternative environment friendly nickel and gold plating baths. Surface Engineering 31:9, pages 641-649.
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A. O. Gezerman & B. D. Çorbacıoğlu. (2014) Use of nickel(II) acetylacetonate and dimethylgold(III) acetylacetonate in gold on nickel plating. Surface Engineering 30:7, pages 483-489.
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Mingyue Yang, Ryo Toyama, Phan Trong Tue & Yutaka Majima. (2019) Interdiffusion during heteroepitaxial Au growth on Pd thin films by electroless Au plating (ELGP) at room temperature. Applied Physics Express 13:1, pages 015006.
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Mingqi Huang, Xiantang Li, Jianwen Xia, Xiaohai Li, Wenyu Qiu, Guoping Zhang, Rong Sun & Yong Mu. (2017) A conceivably stable non-cyanide electroless gold plating for electronic packaging application. A conceivably stable non-cyanide electroless gold plating for electronic packaging application.
Akihiro Uehara, Sin-Yuen Chang, Samuel G. Booth, Sven L.M. Schroeder, J.Frederick W. Mosselmans & Robert A.W. Dryfe. (2016) Redox and Ligand Exchange during the Reaction of Tetrachloroaurate with Hexacyanoferrate(II) at a Liquid-Liquid Interface: Voltammetry and X-ray Absorption Fine-Structure Studies. Electrochimica Acta 190, pages 997-1006.
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S. Harish, James Joseph & K.L.N. Phani. (2011) Interaction between gold (III) chloride and potassium hexacyanoferrate (II/III)—Does it lead to gold analogue of Prussian blue?. Electrochimica Acta 56:16, pages 5717-5721.
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