Citations (9)
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Read on this site (6)
N Pewnim & S Roy. (2011) Effect of fluorosurfactant on copper–tin reduction from methanesulphonic acid electrolyte. Transactions of the IMF 89:4, pages 206-209.
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C T J Low, M de la Toba Corral & F C Walsh. (2011) Anodising of titanium in methanesulphonic acid to form titanium dioxide nanotube arrays. Transactions of the IMF 89:1, pages 44-50.
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A. Vicenzo, S. Bonelli & P. L. Cavallotti. (2010) Pulse plating of matt tin: effect on properties. Transactions of the IMF 88:5, pages 248-255.
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S. Rekha, K. N. Srinivasan & S. John. (2010) Electroless deposition of copper from methane sulphonate complexed bath. Transactions of the IMF 88:4, pages 215-219.
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S. Mohan & N. Rajasekaran. (2009) Pulse electrodeposition of tin from sulphate bath. Surface Engineering 25:8, pages 634-638.
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Articles from other publishers (3)
Simona Zajkoska, Antonio Mulone, Wolfgang Hansal, Uta Klement, Rudolf Mann & Wolfgang Kautek. (2018) Alkoxylated β-Naphthol as an Additive for Tin Plating from Chloride and Methane Sulfonic Acid Electrolytes. Coatings 8:2, pages 79.
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F.C. Walsh & C.T.J. Low. (2016) A review of developments in the electrodeposition of tin. Surface and Coatings Technology 288, pages 79-94.
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Frank C. Walsh & Carlos Ponce de León. (2014) Versatile electrochemical coatings and surface layers from aqueous methanesulfonic acid. Surface and Coatings Technology 259, pages 676-697.
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