Preparation and Properties of Phenolic Epoxy Modified Silicone Resin

Abstract

Phenolic epoxy resin (F51) was first reacted with silane coupling agent (3-aminopropyl)triethoxysilane (KH550) to form a silanized phenolic epoxy resin (SPER); then the SPER was copolymerized with methylphenyl silicone resin (MPS) to synthesize phenolic epoxy modified silicone copolymer (PEMSC). The chemical structure of the PEMSC was characterized by FT-IR. The results of tensile strength and shear strength measurements indicated that the successful introduction of F51 significantly improved the mechanical and adhesive properties of the PEMSC; compared with the PEMSC with 10 phr of F51 added, the tensile strength and shear strength of the PEMSC with 40 phr increased by 8.5 and 3.5 times respectively. The TGA and DTGA analysis showed that the initial thermal decomposition temperature and the residual weight of PEMSC at 800 °C decreased compared to MPS, but the temperature corresponding to the maximum thermal decomposition rate in the second stage increased. Qualitative analysis was conducted on the decomposition products of PEMSC using gas chromatography coupled with mass spectrometry (GC-MS). The results showed that the relative content of aromatic hydrocarbons and their derivatives in the decomposition products of PEMSC was 64.11%, and the relative content of cyclic trimers and higher cyclomers was 20.41%.

Keywords:

• Methylphenyl silicone
• phenolic epoxy
• shear strength
• tensile strength
• thermal properties

Disclosure statement

The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

Additional information

Funding

This work was funded by the Fundamental Research Funds for the Central Universities (2021-zy-001), and the Key Project of Wuhan University of Technology Chongqing Research Institute (ZD2021-02).