Abstract
Three micro heat pipes belonging to different types are selected as the research objects due to their lowest thermal resistance and the steadiest operation according to published literatures. They are the pulsating heat pipe with corrugated configuration (CPHP), the flat-plate heat pipe with eight microchannels (FPMHP) and the radial pulsating heat pipe (RPHP). A mathematical model common to the three micro heat pipes is built, and the maximum deviation between simulation and actual results is 16.1%. It is found that CPHP has the best heat transfer performance with the minimum thermal resistance of 1.14 K·W−1. Its average wall temperature and center-line velocity regularly oscillate after the startup point. There is a pause phenomenon of motion for CPHP, and the pause period of motion decreases from 8.93 s to 7.25 s with the increasing input heat flux. RPHP possesses the most excellent temperature uniformity with the maximum axial temperature difference of 5.24 K. Furthermore, FPMHP is suitable for cooling temperature-resistant devices because its average wall temperature of evaporation section is the highest.
Disclosure statement
On behalf of all the authors, the corresponding author states that there is no conflict of interest.
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Zhikang Wei
Zhikang Wei is studying for a master's degree in mechanical engineering at Beijing Institute of Petrochemical Technology. His current research focuses on heat transfer enhancement.
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Yan Hou
Yan Hou received her bachelor’s degree in thermal and power engineering from the University of Science and Technology Beijing in July 2009 and earned her PhD in engineering thermophysics from the University of Chinese Academy of Sciences in July 2014. Her research interests include spray cooling and heat and mass transfer.
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Yanjun Duan
Yanjun Duan received his PhD in engineering thermophysics from the University of Chinese Academy of Sciences in 2014. He is employed at Beijing Machine and Equipment Institute. He participated in the development of low-temperature heat pipe, vehicle ventilation refrigeration system improvement and other related projects.
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Bin Liu
Bin Liu graduated from the Institute of Engineering Thermophysics of the Chinese Academy of Sciences in 2014 with a doctorate degree in engineering and has stayed at the same institute. He is currently engaged in the research of efficient micro-scale heat transfer, advanced thermal management and high-performance thermal interface materials.