Fluxless soldering of 7034 aluminium in air using protective liquid Ga coatings

Abstract

Fine-grained 7034 aluminium alloys were soldered with Zn–5Al filler metals, using liquid Ga as protective coatings to remove oxide films of the base and filler metals and prevent secondary oxidation. Holding times and coating modes were adjusted by experiments. Applying the Ga coating on both the base and filler metals caused the Ga enrichment in the α-Al particles and the formation of Mg₂Ga₅ intermetallic compound at the bonding interface, deteriorating joint mechanical performance. Ga enrichment was prevented by applying the coating on the filler metal alone, which avoided the early contact of Ga with Al substrate and reduced the mass of Ga in the joint. The tensile strength increased significantly to 159∼185 MPa with a sufficient holding time.

KEYWORDS:

• 7034 aluminium alloy
• fluxless soldering
• Zn-based filler metal
• liquid gallium
• intermetallic compounds

Acknowledgements

This work was supported by National Natural Science Foundation of China under grant number 51975152.

Disclosure statement

No potential conflict of interest was reported by the author(s).

Additional information

Funding

This work was supported by National Natural Science Foundation of China [grant number 51975152].