A wideband folded magnetoelectric dipole antenna with miniaturized integration for 5G applications

Abstract

A 3-layer substrate integrated folded magnetoelectric dipole antenna is presented in this paper. The folded metal vias are proposed to broaden bandwidth and miniaturized antenna. Furthermore, the double-arc-edged patch, the single-arc-edged metal plane, side wall and removing shorted end are designed to improve the impedance matching and reduce the operating frequencies. The structure and parameters of the antenna are analyzed, especially the bandwidth blending and the current paths. A prototype was fabricated and measured. The presented antenna obtains a wide impedance bandwidth of 34.2% for VSWR≤2 from 4.88 to 6.89 GHz and a stable gain ranging from 6.0 to 7.5 dBi. Moreover, nearly identical unidirectional radiation patterns, low cross-polarization and low back radiation are achieved. The parameter of d_s even can realize a lower operating frequency. The presented antenna is suitable for mass production with low cost by the printed circuit board technology, and promising for 5th Generation (5G) applications.

KEYWORDS:

• Folded vias
• integrated magnetoelectric dipole
• wideband
• miniaturization
• 5G applications

Disclosure statement

No potential conflict of interest was reported by the authors.

Additional information

Funding

This work was supported by the National Natural Science Foundation of China [grant numbers 61531016, 61831017]; the Sichuan Provincial Science and Technology Important Projects [grant numbers 2018GZ0139, 2018GZDZX0001].

Notes on contributors

Zhong Du

Zhong Du received the B.S. and M.S. degrees, respectively, in mechanical electronics engineering from Nanchang Hangkong University, Nanchang, China, in 1999, and in computer application technology from Southwest Jiaotong University, Chengdu, China, in 2005. Since 2005 he has been with the School of Computer Science and Technology, Southwest University of Science and Technology, Mianyang, China. He is also currently pursuing the Ph. D. degree at Southwest Jiaotong University, Chengdu, China. His research interests include antenna miniaturization and computer automation.

Quanyuan Feng

Quanyuan Feng received the M.S. degree in microelectronics and solid electronics from the University of Electronic Science and Technology of China, Chengdu, China, in 1991 and the Ph.D. degree in electromagnetic field and microwave technology from Southwest Jiaotong University, Chengdu, in 2000. He is currently the Head of the Institute of Microelectronics, Southwest Jiaotong University. He has been honored as the Excellent Expert and the Leader of Science and Technology of Sichuan Province owing to his outstanding contribution. He has authored or co-authored more than 500 papers published on the IEEE Transactions on Antennas and Propagation, the IEEE Transactions on Microwave Theory and Techniques and the IEEE Antennas and Wireless Propagation Letters, among which more than 300 papers were registered by the Scientific Citation Index (SCI) and Engineering Index (EI). His current research interests include integrated circuit design, RFID technology, embedded system, wireless communications, antennas and propagation, microwave and millimeter-wave technology, smart information processing, electromagnetic compatibility and RF/microwave devices and materials.