Analysis of isothermal solidification kinetics during TLP bonding involving two-dimensional solid–liquid interface migration

ABSTRACT

A new approach is used to model transient liquid phase (TLP) bonding without the simplification assumption of one-dimensional solid–liquid interface migration. In contrast to the general assumption that the single parameter, Φ, that is often used to represent the isothermal solidification kinetics during TLP bonding is constant, this work reports for the first time by coupled numerical simulation and experimental verification that a condition exists where Φ becomes a variable parameter that increases with time. This unique isothermal solidification kinetics behaviour is attributable to a combination of two-dimensional migration of the solid–liquid interface and solute diffusion in a direction along the increase in radius of curvature.

KEYWORDS:

• Transient liquid phase bonding
• diffusion brazing
• isothermal solidification kinetics
• repair
• joining

Acknowledgements

The authors gratefully acknowledge financial support by the Natural Sciences and Engineering Research Council (NSERC) of Canada.

Disclosure statement

No potential conflict of interest was reported by the author(s).

Additional information

Funding

This work was supported by the Natural Sciences and Engineering Research Council of Canada.