Thermographic network identification for transient thermal heat path analysis

ABSTRACT

In this work, an evaluation method for transient thermal measurements is presented. It allows for a high temporal sensitivity by analysing the spectral composition of a thermal transient, the so-called time constant spectrum. The spectral components provide a detailed insight into the heat flow dynamics and thermal parameters describing a multi-layer system. The method is based on a one-dimensional heat path analysis technique common for the thermal characterisation of electronic components, called ‘network identification by deconvolution’. Here, a generalisation, called ‘thermographic network identification’, is presented to obtain spatially resolved thermal equivalence networks as complete thermal model of the device under study. As a proof of concept, two samples are investigated. The method is discussed on the basis of the obtained results.

KEYWORDS:

• Thermal impedance
• time constant spectrum
• thermal structure function
• network identification by deconvolution
• non-destructive testing

Disclosure statement

No potential conflict of interest was reported by the author(s).