Efficacy of multi-mode adhesive systems on dentin wettability and microtensile bond strength of resin composite

Figures & data

Figure 1. Schematic representation of sequence of the experimental protocol.

Table 1. Materials used in the study.

	Composition	pH	Self-etch strategy	Total-etch strategy
Clearfil SE Bond	1. Primer: water, 10-MDP, HEMA, camphorquinone, hydrophilic dimethacrylate	Primer	1. Apply primer to tooth surface and leave in place for 20 s	N.A.
			2. Dry with air stream to evaporate the volatile ingredients
			3. Apply bond to the tooth surface and then create a uniform film using a gentle air stream
			4.Light polymerize for 10 s at 1200 mW/cm2
		2.1 ± 0.01
		Bond
		2.6  ± 0.08
	2. Bonding: 10-MDP, bis-GMA, HEMA, camphorquinone, hydrophobic dimethacrylate, N,N-diethanol p-toluidine bond, colloidal silica
Adper Single Bond 2	1. Etchant: 35% phosphoric acid (Scotchbond Etchant)	4.1  ± 0.02	N.A.	1. Apply etchant for 15 s
				2. Rinse for 10 s
				3. Blot excess water
	2. Adhesive: bis-GMA, HEMA, dimethacrylates, ethanol, water, photoinitiator, methacrylate functional copolymer of polyacrylic and poly (itaconic) acids, 10% by weight of 5 nm-diameter spherical silica particles			4. Apply adhesive for 15 s with gentle agitation
				5. Gently air dry for 5 s
				6. Light polymerize for 10 s at 1200 mW/cm2
All Bond Universal	1. Etchant Uni-Etch: 32% phosphoric acid, benzalkonium Chloride	3.2	1. Apply two separate coats of adhesive, scrubbing the preparation with a microbrush for 10–15 s per coat. Do not light polymerize between coats	1. Apply etchant for 15 s
			2. Evaporate excess solvent by thoroughly air-drying with an air syringe for at least 10 s, there should be no visible movement of the material. The surface should have a uniform glossy appearance	2. Rinse thoroughly
				3. Remove excess water with absorbent pellet or high volume suction for 1–2 s
				4. Apply adhesive as for the self-etch mode
	2. Adhesive: 10-MDP, bis-GMA, HEMA, ethanol, water, initiators
			3. Light polymerize for 10 s at 1200 mW/cm2

Figure 2. The measurement of the contact angle of sessile drops after reaching a flat profile.

Figure 3. Replacement of 3 μl drop of distilled water on prepared dry dentin before adhesive system application.

Figure 4. Replacement of 3 μl drop of the adhesive system on prepared dentin surface.

Figure 5. Replacement of 3 μl drop of distilled water on the adhesive system applied dentin surface.

Table 2. The descriptive statistics and the mean°^±SD° contact angle values.

	Superficial dentine				Deep dentine				Superficial vs deep dentin
	T0	T1	T2	P	T0	T1	T2	P	T0	T1	T2
CSE	59.3° ± 16.0°	58.2° ± 9.9°^d, A, B	50.9° ± 5.9°^d, D, E, F	0.010	70.5° ± 24.6°^k	58.2° ± 14.8°^G, H	52.2° ± 6.7°^k, J, K, L	0.010	0.104	0.992	0.642
SB	66.4° ± 20.2°^a	52.2° ± 3.8°^a, e, C	71.7° ± 7.7°^e, D	<0.001	78.4° ± 12.3°^h	51.8° ± 6.1°^m, h, I	69.5° ± 5.7°^m, J	<0.001	0.082	0.898	0.447
SAU	69.2° ± 17.0°^b	45.3° ± 9.5°^b, f, A	66.4° ± 5.3°^f, E	<0.001	63.3° ± 24.4°^i	40.2° ± 6.2°^n, i, G, I	69.1° ± 4.3°^n, K	<0.001	0.382	0.141	0.354
EAU	64.3° ± 12.5°^c	41.6° ± 5.4° ^c, g, B, C	67.6° ± 5.3°^g, F	<0.001	73.6° ± 9.2°^j	41.4° ± 11.1°^o, j, H	67.4° ± 8.8°^o, L	<0.001	0.174	0.947	0.944
P	0.524	<0.001	<0.001		0.274	<0.001	<0.001

Notes:

Similar capital and small letters show significant difference between columns and rows, respectively. (p < 0.05).

SD: Standard deviation; CSE: Clearfil SE Bond, SB: Single Bond2, SAU: All Bond Universal in self-etch mode, EAU: All Bond Universal in etch&rinse mode T0: Contact angle measurement of distilled water on prepared dentin surface. T1: Contact angle measurement of adhesive system on prepared dentin surface. T2: Contact angle measurement of distilled water on adhesive system applied dentin surface.

Table 3. The descriptive statistics (mean values and the standard deviation) of microtensile bond strength measurements.

	Superficial (MPa ± SD)	Deep (MPa ± SD)	p
CSE	22.6 ± 11.7^B	22.9 ± 11.4^C	0.971
SB	12.8 ± 8.1^A	12.3 ± 7.5^D	0.977
SAU	9.3 ± 4.7^A,a	13.2 ± 7.3^D,b	0.039
EAU	12.7 ± 6.5^A	10.4 ± 4.4^D	0.276
p	<0.001	<0.001

Notes:

Different capital and small letters show significant difference between columns and rows, respectively. (p < 0.05).

SD: Standard deviation; CSE: Clearfil SE Bond, SB: Single Bond2, SAU: All Bond Universal in self-etch mode, EAU: All Bond Universal in etch&rinse mode.