Reduced-cost surrogate modelling of compact microwave components by two-level kriging interpolation

ABSTRACT

Full-wave electromagnetic (EM) analysis is a versatile tool for evaluating the performance of high-frequency components. Its potential drawback is its high computational cost, inhibiting the execution of EM-driven tasks requiring massive simulations. The applicability of equivalent network models is limited owing to the topological complexity of compact microstrip components because of EM cross-coupling effects. Development of alternative representations (surrogate models) is therefore necessary. This article proposes a two-level methodology for reliable modelling of compact microstrip components. The keystone is to define the surrogate domain using the first-level model approximating the set of pre-existing reference designs. This limits the volume of the parameter space region that needs to be sampled when constructing the second-level model. The presented approach provides far greater accuracy than conventional methods and is capable of establishing surrogates covering wide ranges of geometric parameters and operating conditions of a particular structure. Applications for parametric optimization are also provided.

KEYWORDS:

• Microwave design
• compact microwave components
• surrogate modelling
• kriging interpolation
• two-level modelling

Acknowledgement

The authors would like to thank Dassault Systèmes, France, for making CST Studio Suite available.

Disclosure statement

No potential conflict of interest was reported by the authors.

ORCID

Slawomir Koziel http://orcid.org/0000-0002-9063-2647

Anna Pietrenko-Dabrowska http://orcid.org/0000-0003-2319-6782

Additional information

Funding

This work was partially supported by the Icelandic Centre for Research [grant number 174114051] and Narodowe Centrum Nauki [grant number 2015/17/B/ST6/01857].