Soy Protein/Clay Bionanocomposites as Ideal Packaging Materials

Abstract

Soy protein-based bionanocomposites were prepared via solution intercalation with incorporation of the organoclay of different concentrations. The composites were characterized through UV-Visible and Fourier Transform Infrared (FTIR) spectroscopy, X-ray Diffraction (XRD) and Transmission Electron Microscopy (TEM). Thermal resistance of the materials was assessed by thermogravimetric analysis (TGA). The results showed a significant improvement in thermal resistance and glass transition temperature of the bionanocomposites with increase in clay content. The results of oxygen permeability of the nanocomposite films showed a substantial improvement in oxygen barrier property upon clay loading, which could enable the nanocomposites suitable as packaging materials.

Keywords:

• Bionanocomposite
• Oxygen permeability
• Soy protein
• Thermal resistance

ACKNOWLEDGEMENT

The authors gratefully acknowledge the Department of Science and Technology, Government of India for the financial support (Funding Ref: DST/SERC/FTP/130/2006).

Notes

*T₅₀(°C) = Temperature (in degree centigrade) of 50% degradation.

†W_r (%) = Weight percent of the residual char after 600°C.