Epoxy-Filled Microcapsules by Interfacial Engineering

ABSTRACT

In this paper, we demonstrate the successful application of interfacial engineering toward the preparation of epoxy-filled microcapsules. The approach relies on the preferential reaction of polydimethylsilicone insoluble epoxy resin and amine-based hardener to form a cross-linked spherical shell at the interface. Among other features, tailorability is the biggest advantage of this route as both the core content and particle dimensions can be altered by varying the experimental parameters, i.e., stirring speed and resin:hardener ratio. Spherical microcapsules with a core content of 25% were obtained when the reaction was carried out under optimal conditions.

GRAPHICAL ABSTRACT

KEYWORDS:

• Interfacial engineering
• microcapsule
• microencapsulation

Acknowledgment

The authors gratefully acknowledge Director, CFEES for providing logistic support to perform this work.