A molecular dynamics investigation on the compression of cross-linked epoxy resins

Abstract

Molecular dynamics method is employed to simulate the compression deformation of the polymer materials for electronic packaging. The effects of moisture content, conversion degree, strain rate and temperature on the mechanical properties of epoxy resin are investigated. The stress–strain curves, Young's modulus and Poisson ratio are compared with existing experimental data. The results show that mechanical properties of epoxy resin decrease obviously with increasing moisture content and temperature. However, the high cross-linking conversion and strain rate enhance the mechanical properties of resin.

Keywords::

• molecular dynamics
• mechanical properties
• epoxy resin

Disclosure statement

No potential conflict of interest was reported by the authors.

Additional information

Funding

The authors wish to acknowledge the support from the National Natural Science Foundation of China [grant number 11272123] and [grant number 11472108], Educational Commission of Fujian Province [grant number JA14220] and Scientific Research Staring Foundation from Fujian University of Technology [grant number GY-Z14070].