Abstract
MFIS (metal-ferroelectric-insulator-semiconductor) diodes and transistors having a BNT((Bi, Nd)4Ti3O12)/HfO2/Si (100) structure were fabricated and their data retention characteristics were characterized. HfO2 and BNT thin films were formed by E-B (electron beam) deposition and chemical solution deposition (CSD) methods, respectively. The Pt/BNT/HfO2/Si MFIS diodes showed the hysteretic -V (capacitance-voltage) characteristic and the retention time was as long as 5 days. In the case of the Pt/BNT/HfO2/Si MFIS transistor, the drain current on-off ratio was larger than 104 initially and it was about 1,000 at a time of 1 day after the “write” operation.
ACKNOWLEDGMENTS
This work was performed under the auspices of the R&D Projects in Cooperation with Academic Institutions (Next-Generation Ferroelectrictric Memories) supported by NEDO (New Energy and Industrial Technology Development Organization in Japan) and managed by FED (R&D Association for Future Electron Devices).