Figures & data
Figure 1. (a) Conceptual diagram of bolts in automobiles. (b1, b2) the schematic of inserting the TENG sensor into the loose bolt. (c1-c6) the fabrication process of CCTO/PDMS film and CP-TENG device. (d) the picture of gasket with copper foil attached. (e) the picture of gasket with CCTO/PDMS film attached. (f) the SEM image of CCTO/PDMS film surface.
![Figure 1. (a) Conceptual diagram of bolts in automobiles. (b1, b2) the schematic of inserting the TENG sensor into the loose bolt. (c1-c6) the fabrication process of CCTO/PDMS film and CP-TENG device. (d) the picture of gasket with copper foil attached. (e) the picture of gasket with CCTO/PDMS film attached. (f) the SEM image of CCTO/PDMS film surface.](/cms/asset/b0e39301-d143-419b-9162-692fa33aaa0e/ymte_a_2214775_f0001_oc.jpg)
Figure 2. (a) Structural diagram of mechanical system for CP-TENG device. (b) the output signal waveform of Voc and Isc of CP-TENG device. (c1, c2) the working principle of CP-TENG device. The (d) Voc and (e) Isc of CP-TENG under different temperature. (f, g) the influence of CCTO/PDMS film thickness on CP-TENG output performance under different acceleration conditions.
![Figure 2. (a) Structural diagram of mechanical system for CP-TENG device. (b) the output signal waveform of Voc and Isc of CP-TENG device. (c1, c2) the working principle of CP-TENG device. The (d) Voc and (e) Isc of CP-TENG under different temperature. (f, g) the influence of CCTO/PDMS film thickness on CP-TENG output performance under different acceleration conditions.](/cms/asset/0f6c4dd1-67a3-4c5f-8b69-1c2f8aac121f/ymte_a_2214775_f0002_oc.jpg)
Figure 3. (a) the Voc of CP-TENG under different acceleration. (b) the Isc of CP-TENG under different acceleration. (c, d) the reliability testing of CP-TENG device.
![Figure 3. (a) the Voc of CP-TENG under different acceleration. (b) the Isc of CP-TENG under different acceleration. (c, d) the reliability testing of CP-TENG device.](/cms/asset/83411880-12c8-41c0-8c12-3fcb17191469/ymte_a_2214775_f0003_oc.jpg)
Figure 4. (a) System overview diagram of CP-TENG device for vibration monitoring. (b) the output voltage signal of CP-TENG device during vibration process. (c) the picture of bolt vibration test scenario. (d) the time domain signal and FFT spectrum of the CP-TENG device.
![Figure 4. (a) System overview diagram of CP-TENG device for vibration monitoring. (b) the output voltage signal of CP-TENG device during vibration process. (c) the picture of bolt vibration test scenario. (d) the time domain signal and FFT spectrum of the CP-TENG device.](/cms/asset/9160ec00-a034-47c8-8ae5-00bb7904d784/ymte_a_2214775_f0004_oc.jpg)
Figure 5. (a) the output voltage signal of CP-TENG under normal operation. (b) the output voltage signal of CP-TENG under breakdown state. The output voltage signal of CP-TENG under (c) compression state and (d) loose state. (e) the output voltage signal of CP-TENG under low-frequency impact conditions.
![Figure 5. (a) the output voltage signal of CP-TENG under normal operation. (b) the output voltage signal of CP-TENG under breakdown state. The output voltage signal of CP-TENG under (c) compression state and (d) loose state. (e) the output voltage signal of CP-TENG under low-frequency impact conditions.](/cms/asset/7f127e5b-1108-4c17-b882-c10f35f56688/ymte_a_2214775_f0005_oc.jpg)