Effects of compressive strain on the evolution of interfacial strength of steel/nickel solid-state bonding at low temperature

ABSTRACT

Solid-state bonding between ultralow-carbon steel and pure nickel was conducted by hot pressing with various compressive strain ranging from 5 to 15% and subsequent isothermal holding at 923 K. It was found that the interfacial strength of contact area is accounted for by the evolution of the intrinsic strength of the interface and the amount of plastic energy dissipation at the crack tip during interface fracture. The compression induces severe deformation around the interface and consequently inhibits the plastic energy dissipation during interface fracture. In the first stage of isothermal holding, the residual strain around the interface on the steel side is reduced by recovery process, which concurrently decreases in the yield stress of the area adjacent to the interface. This promotes plastic energy dissipation of the area, leading to a significant increase in interfacial strength in the first stage.

KEYWORDS:

• Solid-state bonding
• steel
• nickel
• interfacial strength

Disclosure statement

No potential conflict of interest was reported by the authors.