Figures & data
Figure 2. SEM images of thin films fabricated by the liquid-liquid interface assembly technique using the C60 NCs dispersion. The deposition times were (a) 1 time, (b) 2 times, (c) 3 times and (d) 4 times and baked at 120 °C for 20 min.
![Figure 2. SEM images of thin films fabricated by the liquid-liquid interface assembly technique using the C60 NCs dispersion. The deposition times were (a) 1 time, (b) 2 times, (c) 3 times and (d) 4 times and baked at 120 °C for 20 min.](/cms/asset/0919d0c5-546d-4479-bf26-8b2b67e6e95e/gmcl_a_1096494_f0002_b.gif)
Figure 3. Coverage rate of thin films fabricated by the liquid-liquid interface assembly technique using the C60 NCs dispersion.
![Figure 3. Coverage rate of thin films fabricated by the liquid-liquid interface assembly technique using the C60 NCs dispersion.](/cms/asset/46202c86-1fe7-4cd2-a58f-0454370f1470/gmcl_a_1096494_f0003_c.gif)
Figure 4. The AFM images of fabricated thin films fabricated by liquid-liquid interface assembly technique using the C60 NCs dispersion. The deposition times were (a) 1 time, (b) 2 times, (c) 3 times and (d) 4 times and baked at 120 °C for 20 min.
![Figure 4. The AFM images of fabricated thin films fabricated by liquid-liquid interface assembly technique using the C60 NCs dispersion. The deposition times were (a) 1 time, (b) 2 times, (c) 3 times and (d) 4 times and baked at 120 °C for 20 min.](/cms/asset/f3fec20e-22fe-4895-9532-aee475d4c793/gmcl_a_1096494_f0004_c.gif)