Cooling of multichip light emitting diode with ultra-high power—An application of bypass cooling from an air-conditioning system

ABSTRACT

This study focuses on the use of indium gallium nitride multichip for ultra-high power light emitting diode (LED) heat transfer and thermal cooling analysis. This research approach is based on the multichip LED experimental study of aluminum extrusion heat sink and air-conditioning system-forced cooling approach. An investigation of heat transfer characteristics of the phenomenon of variation is conducted to improve performance and develop an LED system that can become a reference guideline for thermal design and assembly. This study’s package structure can use silicon substrate material and fill copper material to increase thermal conduction. An air-conditioning system bypass cooling approach is also used. This study aims to help to increase LED thermal cooling, long life, reliability, and reduce the optic lumen decay phenomenon in the future. Results are based on different power ratings that can be used to redefine LED classifications.

KEYWORDS:

• Air-conditioning system
• bypass cooling
• light emitting diode
• multichip
• ultra high power

Acknowledgment

Thanks to associate professor Yu-Lieh Wu for supporting the standard airflow rate apparatus (AMCA 210-99) and constant temperature and humidity machine.

Funding

The author would like to thank the Ministry of Science and Technology of Taiwan of the Republic of China for financially supporting this research under contract Nos. MOST 104-2221-E-167-015, MOST 104-ET-E-167-001-ET, NSC 101-2622-E-167-014-CC3, NSC 102-2815-C-167-011-E, and NSC 100-2815-C-167-002-E.

Additional information

Funding

The author would like to thank the Ministry of Science and Technology of Taiwan of the Republic of China for financially supporting this research under contract Nos. MOST 104-2221-E-167-015, MOST 104-ET-E-167-001-ET, NSC 101-2622-E-167-014-CC3, NSC 102-2815-C-167-011-E, and NSC 100-2815-C-167-002-E.