https://orcid.org/0000-0003-3118-5258
Figures & data
Figure 1. Surface analysis of copper conductive balls using energy dispersive spectrometry (EDS): (a) Surface image of conductive copper balls using scanning electron microscope (SEM), (b) Image of copper-corresponding parts mapped to dots, and (c) Inorganic measurement graph by analyzing the surface image.
Figure 2. Copper oxidation changed with corrosive coating time: (a) Reference, (b) None, (c) 30 s, (d) 120 s, and (e) 180 s.
Figure 3. Oxidized area of corrosive coating time.
Figure 4. Copper oxidation changed with corrosive coating concentration: (a) Reference, (b) None, (c) 0.94 wt%, (d) 1.4 wt%, and (e) 1.86 wt%.
Figure 5. Oxidized area of corrosive coating concentration.
Figure 6. Reliability test (temperature 85°C and humidity 85%) of conductive copper balls without corrosive coating: (a) 0 h, (b) 12 h, (c) 24 h, (d) 48 h, (e) 72 h, and (f) 96 h.
Figure 7. Reliability test (temperature 85°C and humidity 85%) of conductive copper ball with corrosive coating: (a) 0 h, (b) 12 h, (c) 24 h, (d) 48 h, (e) 72 h, and (f) 96 h.
Figure 8. Cross-sectional scanning electron microscope (SEM) image of coating thickness according to corrosive coating time: (a) 30 s, (b) 60 s, (c) 120 s, and (d) 180 s.
Figure 9. Corrosive coating thin film thickness according to coating time.
Figure 10. Cross-sectional scanning electron microscope (SEM) image of coating thickness with corrosive coating concentration: (a) 0.47 wt%, (b) 0.94 wt%, (c) 1.4 wt%, and (d) 1.84 wt%.
Figure 11. Corrosive coating film thickness according to coating concentration.
Figure 12. Conductive ball surface and cross-sectional image according to copper plating thickness: (a) 0.1 um, (b) 0.25 um, (c) 0.5 um, (d) 0.1 um cross section, (e) 0.25 um cross section, and (f) 0.5 um cross section.
Figure 13. Contact resistance by thickness of corrosive coating.
Figure 14. Conductive ball contact resistance by surface metal.
Figure 15. Reliability test (temperature 85°C and humidity 85%) by corrosive coating.
