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Articles

Bi-material strip based temperature sensor design and optimization through thermo-mechanical multi-physics modeling

, , & ORCID Icon
Pages 1-10 | Received 28 Jul 2018, Accepted 17 Sep 2018, Published online: 09 Oct 2018

Figures & data

Figure 1. Schematics of (a) a bi-material strip with three design patterns: (b) standard design; (c) E-shape design; (d) S-shape design.

Figure 1. Schematics of (a) a bi-material strip with three design patterns: (b) standard design; (c) E-shape design; (d) S-shape design.

Figure 2. Curvature variation with respect to modulus ratio and thickness ratio of the bi-material strip.

Figure 2. Curvature variation with respect to modulus ratio and thickness ratio of the bi-material strip.

Figure 3. Thermal sensitivity variation with respect to different design parameters: (a) thickness; (b) CTE difference; (c) thickness ratio; and (d) modulus ratio.

Figure 3. Thermal sensitivity variation with respect to different design parameters: (a) thickness; (b) CTE difference; (c) thickness ratio; and (d) modulus ratio.

Figure 4. Normalized deflection variation of three design patterns with respect to ρt and volume fraction Vf at ρE = 0.1.

Figure 4. Normalized deflection variation of three design patterns with respect to ρt and volume fraction Vf at ρE = 0.1.

Figure 5. Normalized deflection variation of three design patterns with respect to ρt and volume fraction Vf at ρE = 1.

Figure 5. Normalized deflection variation of three design patterns with respect to ρt and volume fraction Vf at ρE = 1.

Figure 6. Normalized deflection variation of three design patterns with respect to ρt and volume fraction Vf at ρE = 10.

Figure 6. Normalized deflection variation of three design patterns with respect to ρt and volume fraction Vf at ρE = 10.

Figure 7. Normalized deflection variation comparison between analytical prediction and FEA simulation of E-shape design, with respect to volume fraction, thickness ratio and modulus ratio.

Figure 7. Normalized deflection variation comparison between analytical prediction and FEA simulation of E-shape design, with respect to volume fraction, thickness ratio and modulus ratio.