Interfacial reactions in thermoelectric modules

Figures & data

Figure 1. SAC305 reflow on (Bi,Sb)₂Te₃ substrate at 250°C (a) without diffusion barrier for 30 min (b) with Ni–P (c) with Co–P diffusion barrier and aging at 150°C for 15 days.

Figure 2. n-type PbTe bonded on Cu [43] (a) without (b) with Co–P diffusion barrier. n-PbTe bonded on Ni (c) without (d) with Co–P diffusion barrier, at 650°C for 60 min.

Hsieh HC, Wang CH, Lin WC, et al. Electroless Co-P diffusion barrier for n-PbTe thermoelectric material. J Alloy Compd. 2017;728:1023–1029.

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