Al₂O₃/glass/hBN composites with high thermal conductivity and low dielectric constant for low temperature cofired ceramic applications

Figures & data

Figure 1. Densification of the samples as a function of hBN content and temperature

Figure 2. Densification of the samples fabricated via different methods and sintered at 800°C

Figure 3. XRD patterns of the dry-pressed samples sintered at 800°C

Figure 4. XRD patterns of the dry-pressed and tape-casted G55-5 samples sintered at various temperatures

Figure 5. SEM pictures of the samples sintered at 800°C; (a) G55, (b) G55-2.5 hBN, (c) dry-pressed G55-5 hBN and (d) tape-casted G55-5 hBN

Figure 6. Dielectric properties measured at 5 MHz for the samples sintered at 800°C

Figure 7. Thermal conductivity of the samples sintered at 800ºC