Abstract
Cu-SiCp composites made by the powder metallurgy method were investigated. To avoid the adverse effect of Cu-SiCp reaction, sintering was controlled at a reaction temperature less than 1032 K. Electroless plating was employed to deposit a copper film on SiCp powder before mixing with Cu powder in order to improve the bonding status between Cu and SiC particles during sintering. It was found that a continuous copper film could be deposited on SiCp by electroless copper plating, and a uniform distribution of SiCp in Cu matrix could be achieved after the sintering and extrusion process. The mechanical properties of Cu-SiCp composites with SiCp contents from 0.6 to 10 wt% were improved evidently, whereas electrical properties remained almost unchanged as compared with that of the pure copper counterpart. In the electrical discharge machining (EDM) test, the as-formed composite electrodes exhibited a character of lower electrode wear ratio, justifying its usage. The optimum conditions for EDM were Cu–2 wt% SiCp composite electrode operating with a pulse time of 150 μsec.
5.0 ACKNOWLEDGMENTS
The authors thank the National Science Council of the Republic of China for the financial support under Grant NSC86-2216-E-009-016 for the experimental aspect of the study. Special thanks are acknowledged to one of the reviewers, who reviewed carefully and made many valuable suggestions on the paper.