Abstract
A chelate resin that adsorbed bathocuproinedisulfonate ion on an anion exchange resin was synthesized, and then polystyrene microcapsules containing the chelate resin were prepared by interfacial polymerization with W/O/W emulsions. The adsorption behavior of metallic ions such as Cu 2+, Cd 2+, Co 2+, Ni 2+, and Zn 2+ ions into the microcapsules obtained then was examined at 25°C. The adsorption rate of the Cd 2+ ion to the microcapsules was over 9 times more than that of the Cu 2+, Co 2+, Ni 2+, and Zn 2+ ions. None of the metallic complexes trapped in the microcapsules were affected by the outside environment such as pH, and the Cd 2+ ion remained unaffected in the microcapsules even in a highly acidic solution.