Mesmoproc – implementation of a maskless electrochemical surface modification process

Abstract

Conventional approaches to the fabrication of fine features in the printed circuit board and metal finishing industries typically employ a multistage photolithography stage to process each individual substrate, which is both inefficient and wasteful of valuable materials. By developing and implementing a maskless electrochemical process that decreases the use of lithography, the Mesmoproc project aims to assist European industry in these sectors.

This is an edited version of an article first published in Circuit World (Emerald Group Publishing Limited), Vol. 39, Issue: 2. The Mesmoproc project is supported by funding from the European Commission. The sole responsibility for the content of this article lies with the authors. It does not necessarily reflect the opinion of the European Communities. The European Commission is not responsible for any use that may be made of the information contained therein.