PyX3: Ir bolometers and thermal imaging: The role of ferroelectric materials

Abstract

Large arrays of bolometer elements have considerable potential for thermal imaging applications, offering uncooled operation, and a performance which challenges the cooled semiconductor detectors. A hybrid array technology, exploiting pyroelectric materials, is the basis of a successful range of linear and 2-D arrays. Ceramic uniformity for large area arrays is good but wafer processing is demanding. Other technologies will compete for cost-effectiveness in large area devices. Ferroelectric thin films have recently shown marked improvement in the merit figures and, if compatible with the silicon IC, may allow a more direct array fabrication. Thin film resistance bolometers have advantages in ease of fabrication, but there are also some inherent disadvantages, when compared with the ferroelectric operation.