Investigation on the effect of nickel and nickel-chromium alloy pulse current plating on copper substrate

ABSTRACT

In the present study, nanocrystalline nickel (Ni) and nickel-chromium (Ni-Cr) alloy coatings were developed on copper (Cu) substrate using pulse current. The pulse current parameters include a cycle time of 240 milliseconds at a duty cycle of 0.5 and 4.17 Hz frequency. The surface morphology, texture, hardness, scratch resistance and porosity were investigated for different coatings developed by pulse plating. Energy Dispersive Spectroscopy (EDS) analysis revealed good quality Ni and Ni-Cr alloy coatings developed on the copper substrate. The peak current of the pulse has been observed to have an impact on the coating weight and thickness. The micrographs of the coatings explored under Field Emission Scanning Electron Microscopy (FESEM), depict uniform coatings consisting of fine primary and coarse secondary granules of Ni and Cr. The hard primary and secondary Ni granules deposited on the surface of Cu increase its hardness, corrosion and wear resistance. Further, it was observed that the Ni-Cr alloy plated samples are harder and less porous in nature compared to Ni plated samples.

KEYWORDS:

• Ni-Cr alloy
• pulse current plating
• Cu substrate
• hardness
• porosity
• electrodeposition

Disclosure statement

No potential conflict of interest was reported by the author(s).