Editorial

In this issue we feature pulse plating in three of the papers published. Following a tradition of Transactions’ support dating back to the earliest of the biennial events, two of these are from the 10th European Pulse Plating Seminar, held in conjunction with the 14th EDNANO Conference in Krakow, Poland in June of last year. F. Lissandrello and L. Magagnin of Politecnico Milano, Italy, review pulsed electrochemical deposition of calcium phosphate coatings for biomedical applications, very much a field of great interest at present, while H. Hilton-Tapp and her colleagues at Leicester University, UK, report on the design of effective plating baths for use in the pulse-reverse plating of copper nanocomposite coatings. The third pulse plating paper features an investigation on nickel and nickel-chromium alloy pulse current plating on copper substrate by C. Sherwin and colleagues from St Joseph Engineering College, and Srinivas School of Engineering, both based in Mangaluru, India, and the University of Calabria, Cosenza, Italy.

Other topics covered in this issue include a study on coating characteristics and corrosion resistance of hard-anodised 6061-T6 aluminium alloy from S. H. Mohitfar et al., Sahand University of Technology, Tabriz, Iran, a critical review of recent advances and challenges associated in thin film coatings of cutting tools by N. Radhika and co-authors, representing Amrita School of Engineering, India; Hohai University, Nanjing, PRC, and Alexandria University, Egypt and a study on a Ce–Mn co-doped SnO₂–Sb anode based on a nanotubular TiO₂ array for electrochemical decolourisation of wastewater is reported by S. Ge and colleagues at Nanjing Technical University, PRC. Sadly we also have to say goodbye to yet another highly respected friend in our field, this time Prof Sam Harris of Nottingham University, whose obituary in these pages has been compiled by ex student and colleague, Dr Laurence Archibald.

In addition, we are delighted to welcome to our pool of Editorial Board Members, Dr Lars Pleth Nielsen who recently set up Advanced Surface Plating (ASP), Højbjerg in Denmark. Previously, Dr Nielsen was for some years at the Teknologisk Institut, Aarhus in Denmark. He has just co-authored an article¹ in Transactions on developing improved performance of electrodes for alkaline electrolysis, in which ASP is very much involved. We are sure he will be a great asset to the journal.